hmc527 Hittite Microwave Corporation, hmc527 Datasheet
hmc527
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hmc527 Summary of contents
Page 1
... Isolation High Input IP3: +28 dBm Die Size: 1.49 x 1.14 x 0.1 mm General Description The HMC527 is a compact I/Q MMIC mixer which can be used as either an Image Reject Mixer or a Single Sideband Upconverter. The chip utilizes two standard Hittite double balanced mixer cells and a 90 degree hybrid fabricated in a GaAs MESFET process ...
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... Return Loss 0 -5 -10 -15 -20 - Input IP3 vs. LO Drive Order On-line at www.hittite.com HMC527 8.5 - 13.5 GHz +25C +85C -55C FREQUENCY (GHz FREQUENCY (GHz +17 dBm LO = +19 dBm LO = +21 dBm 10 11 ...
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... Upconverter Performance Sideband Rejection vs. LO Drive -10 -20 -30 -40 +17 dBm +19 dBm -50 +21 dBm - Order On-line at www.hittite.com HMC527 GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz 0 RETURN LOSS CONVERSION GAIN 0.5 1 1 FREQUENCY (GHz +17 dBm LO = +19 dBm LO = +21 dBm ...
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... All values in dBc below IF power level ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Die Packaging Information Standard GP-2 [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. Order On-line at www.hittite.com HMC527 8.5 - 13.5 GHz nLO - ...
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... For operation to DC, this pad must not source/sink more than 3mA of current or die non-function and possible die failure will result. Pads 5 and 6 are alternate IF ports. The backside of the die must be connected to RF/DC ground. Order On-line at www.hittite.com HMC527 GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz Interface Schematic ...
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... Thick GaAs MMIC 0.076mm (0.003”) 0.102mm (0.004”) Thick GaAs MMIC 0.076mm (0.003”) 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC527 8.5 - 13.5 GHz Wire Bond 3 RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Wire Bond RF Ground Plane 0.254mm (0.010” ...