hmc516 Hittite Microwave Corporation, hmc516 Datasheet
hmc516
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hmc516 Summary of contents
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... Typical Applications The HMC516 is ideal for use as a LNA or driver ampli for: • Point-to-Point Radios • Point-to-Multi-Point Radios & VSAT • Test Equipment and Sensors • Military & Space Functional Diagram Electrical Specifi cations, Parameter Frequency Range Gain ...
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... Output IP3 vs. Temperature Order On-line at www.hittite.com HMC516 +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C FREQUENCY (GHz) ...
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... Gain, Noise Figure & Power vs. Supply Voltage @ 12 GHz 24 22 Gain 20 18 P1dB 16 14 Noise Figure 12 10 2.5 3 Vdd (V) Order On-line at www.hittite.com HMC516 AMPLIFIER GHz 8 6 +25C +85C 4 -55C FREQUENCY (GHz) Pout Gain PAE 5 0 -20 ...
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... OBSERVE HANDLING PRECAUTIONS [1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Order On-line at www.hittite.com HMC516 1 Idd (mA ...
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... Power Supply Voltage for the amplifi er. External bypass capacitors of 100 pF and 0.1 μF are required. This pad is AC coupled and matched to 50 Ohms. These pads must be connected to RF/DC ground for proper operation. Die Bottom must be connected to RF/DC ground. Order On-line at www.hittite.com HMC516 AMPLIFIER GHz Interface Schematic ...
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... Thick GaAs MMIC 0.076mm 0.102mm (0.004”) Thick GaAs MMIC 0.076mm 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC516 3 mil Ribbon Bond (0.003”) RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. 3 mil Ribbon Bond (0.003” ...