hmc518 Hittite Microwave Corporation, hmc518 Datasheet
hmc518
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hmc518 Summary of contents
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... Typical Applications The HMC518 is ideal for use as a LNA or driver ampli for: • Point-to-Point Radios • Point-to-Multi-Point Radios & VSAT • Test Equipment and Sensors • Military & Space Functional Diagram Electrical Specifi cations, Parameter Frequency Range Gain ...
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... Output Return Loss vs. Temperature 0 -5 -10 -15 -20 - Output IP3 vs. Temperature Order On-line at www.hittite.com HMC518 +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C 24 26 ...
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... Gain, Noise Figure & Power vs. Supply Voltage @ 29 GHz Gain 14 P1dB 2.5 3 Vdd (V) Order On-line at www.hittite.com HMC518 AMPLIFIER GHz +25C 8 +85C -55C FREQUENCY (GHz) Pout 8 Gain PAE 4 0 -20 -15 ...
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... NOTES: [1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Order On-line at www.hittite.com HMC518 1 Idd (mA ...
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... Power Supply Voltage for the amplifi er. External bypass capacitors of 100 pF and 0.1 μF are required. This pad is AC coupled and matched to 50 Ohms. These pads must be connected to RF/DC ground for proper operation. Die Bottom must be connected to RF/DC ground. Order On-line at www.hittite.com HMC518 AMPLIFIER GHz Interface Schematic ...
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... Thick GaAs MMIC 0.076mm 0.102mm (0.004”) Thick GaAs MMIC 0.076mm 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC518 3 mil Ribbon Bond (0.003”) RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. 3 mil Ribbon Bond (0.003” ...