hmc576 Hittite Microwave Corporation, hmc576 Datasheet - Page 4

• Manufacturer Part Number: hmc576
• Description: Gaas Mmic X2 Active Frequency Multiplier, 18 - 29 Ghz Output
• Manufacturer: Hittite Microwave Corporation

Absolute Maximum Ratings
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] Reference this suffix only when ordering alternate die
packaging.
RF Input (Vdd = +5V)
Supply Voltage (Vdd1, Vdd2)
Channel Temperature
Continuous Pdiss (T= 85 °C)
(derate 7.9 mW/°C above 85 °C)
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
Standard
GP-2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
+20 dBm
+6.0 Vdc
175 °C
709 mW
126 °C/W
-65 to +150 °C
-55 to +85 °C
Alternate [2]
v00.0506
—
Order On-line at www.hittite.com
[1]
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 18 - 29 GHz OUTPUT
Typical Supply Current vs. Vdd
Note:
Multiplier will operate over full voltage range shown above.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE.
4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METALIZATION: GOLD
7. BACKSIDE METAL IS GROUND.
8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.
Vdd (Vdc)
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
4.5
5.0
5.5
HMC576
Idd (mA)
82
82
83
2 - 53
2