hmc556 Hittite Microwave Corporation, hmc556 Datasheet - Page 4

• Manufacturer Part Number: hmc556
• Description: Gaas Mmic I/q Mixer Chip, 36 - 41 Ghz
• Manufacturer: Hittite Microwave Corporation

Absolute Maximum Ratings
Outline Drawing
RF Input
IF1 / IF2 Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 8.95 mW/°C above 85°C)
Thermal Resistance (R
(channel to die bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
)
+19 dBm
+24 dBm
+27 dBm
150°C
582 mW
111.6 °C/W
-65 to +150 °C
-55 to +85 °C
Class 1A
v00.0106
Order On-line at www.hittite.com
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 39.1 GHz @ -10 dBm
LO = 39 GHz @ +17 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
WP-3
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
9. THIS DIE IS DESIGNED FOR PICK-UP WITH
22
xx
xx
xx
xx
0
UNLABELED BOND PADS.
VACUUM (EDGE) COLLET TOOLS. TO PRECLUDE
THE RISK OF PERMANENT DAMAGE, NO CONTACT
TO THE DIE SURFACE IS ALLOWED WITHIN THIS
RECTANGULAR AREA.
GaAs MMIC I/Q MIXER
-12
55
xx
xx
1
0
nLO
44
60
87
xx
xx
2
36 - 41 GHz
HMC556
Alternate
xx
xx
56
78
85
[2]
3
[1]
104
xx
xx
xx
89
4
3 - 129
3