hmc564 Hittite Microwave Corporation, hmc564 Datasheet
hmc564
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hmc564 Summary of contents
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... Typical Applications The HMC564 is ideal for use as a LNA or driver ampli for: • Point-to-Point Radios • Point-to-Multi-Point Radios • Test Equipment and Sensors • Military & Space Functional Diagram Electrical Specifi cations, Frequency Range Gain Gain Variation Over Temperature ...
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... Output Return Loss vs. Temperature 0 -5 -10 -15 -20 - Reverse Isolation vs. Temperature 0 -10 -20 -30 -40 - Order On-line at www.hittite.com HMC564 +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C 9 10 ...
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... Gain, Noise Figure & Power vs. Supply Voltage @ 8 GHz 20 16 P1dB Gain 12 8 Noise Figure 4 0 2.5 3 Vdd (Vdc) Order On-line at www.hittite.com HMC564 AMPLIFIER 13.5 GHz +25C 8 +85C -55C FREQUENCY (GHz) Pout 5 Gain PAE 0 -15 ...
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... NOTES: [1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Order On-line at www.hittite.com HMC564 1 Idd (mA ...
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... This pad is AC coupled and matched to 50 Ohms from 7 - 13.5 GHz. Power Supply Voltage for the amplifi er. External bypass capacitors of 100 pF and 0.1 μF are required. This pad is AC coupled and matched to 50 Ohms from 7 - 13.5 GHz. Die Bottom must be connected to RF/DC ground. Order On-line at www.hittite.com HMC564 AMPLIFIER 13.5 GHz Interface Schematic ...
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... Thick GaAs MMIC 0.076mm 0.102mm (0.004”) Thick GaAs MMIC 0.076mm 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC564 Wire Bond (0.003”) RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Wire Bond (0.003” ...