hmc566 Hittite Microwave Corporation, hmc566 Datasheet
hmc566
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hmc566 Summary of contents
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... Typical Applications The HMC566 is ideal for use as a LNA or driver ampli for: • Point-to-Point Radios • Point-to-Multi-Point Radios & VSAT • Test Equipment and Sensors • Military & Space Functional Diagram Electrical Specifi cations, Parameter Frequency Range Gain ...
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... Reverse Isolation vs. Temperature 0 -10 -20 -30 -40 - Order On-line at www.hittite.com HMC566 +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C 31 ...
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... Gain, Noise Figure & Power vs. Supply Voltage @ 32 GHz Gain P1dB Noise Figure 4 2.5 3 Vdd (Vdc) Order On-line at www.hittite.com HMC566 AMPLIFIER GHz +25C +85C -55C FREQUENCY (GHz) Pout Gain PAE -16 ...
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... NOTES: [1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Order On-line at www.hittite.com HMC566 1 Idd (mA ...
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... Ohms from GHz. Power Supply Voltage for the amplifi er. External bypass capacitors of 100 pF and 0.1 μF are required. This pad is AC coupled and matched to 50 Ohms from GHz. Die Bottom must be connected to RF/DC ground. Order On-line at www.hittite.com HMC566 AMPLIFIER GHz Interface Schematic ...
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... Thick GaAs MMIC 0.076mm 0.102mm (0.004”) Thick GaAs MMIC 0.076mm 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC566 Wire Bond (0.003”) RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Wire Bond (0.003” ...