hmc562 Hittite Microwave Corporation, hmc562 Datasheet

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hmc562

Manufacturer Part Number
hmc562
Description
Wideband Driver Amplifier Chip, 2 - 35 Ghz
Manufacturer
Hittite Microwave Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HMC562
Manufacturer:
HITTITE
Quantity:
5 000
Part Number:
hmc5622LS7
Manufacturer:
MAXIM
Quantity:
1 100
2 - 34
2
Typical Applications
The HMC562 wideband driver is ideal for:
• Military & Space
• Test Instrumentation
• Fiber Optics
Functional Diagram
Electrical Specifi cations,
* Adjust Vgg between -2 to 0V to achieve Idd= 80 mA typical.
Frequency Range
Gain
Gain Flatness
Gain Variation Over Temperature
Input Return Loss
Output Return Loss
Output Power for 1 dB Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (IP3)
Noise Figure
Supply Current
(Idd) (Vdd= 8V, Vgg = -0.8V Typ.)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
Parameter
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
T
A
v03.0807
= +25° C, Vdd= +8V, Idd= 80 mA*
Min.
9.5
15
Order On-line at www.hittite.com
2.0 - 15.0
±0.4
Typ.
12.5
0.01
21.5
14
16
18
27
80
3
Max.
0.02
100
Features
P1dB Output Power: +18 dBm
Gain: 12.5 dB
Output IP3: +27 dBm
Supply Voltage: +8V @ 80 mA
50 Ohm Matched Input/Output
Die Size: 3.12 x 1.42 x 0.1 mm
General Description
The HMC562 is a GaAs MMIC PHEMT Distributed
Driver Amplifi er die which operates between 2 and
35 GHz. The amplifi er provides 12.5 dB of gain,
+19 dBm output IP3 and +12 dBm of output power
at 1 dB gain compression while requiring 80 mA
from a +8V supply. The HMC562 is ideal for EW,
ECM and radar driver amplifi er applications. The
HMC562 amplifi er I/O’s are DC blocked and internally
matched to 50 Ohms facilitating integration into Multi-
Chip-Modules (MCMs). All data is taken with the chip
connected via two 0.075mm (3 mil) ribbon bonds of
minimal length 0.31mm (12 mils).
Min.
8.5
14
GaAs PHEMT MMIC WIDEBAND
DRIVER AMPLIFIER, 2 - 35 GHz
15.0 - 27.0
±0.35
0.01
Typ.
3.5
12
13
15
17
20
24
80
Max.
0.02
100
Min.
10
7
27.0 - 35.0
HMC562
0.02
Typ.
±1.3
10
10
12
14
16
22
80
5
Max.
0.03
100
dB/ °C
Units
GHz
dBm
dBm
dBm
mA
dB
dB
dB
dB
dB

Related parts for hmc562

hmc562 Summary of contents

Page 1

... GHz. The amplifi er provides 12 gain, +19 dBm output IP3 and +12 dBm of output power gain compression while requiring 80 mA from a +8V supply. The HMC562 is ideal for EW, ECM and radar driver amplifi er applications. The HMC562 amplifi er I/O’s are DC blocked and internally matched to 50 Ohms facilitating integration into Multi- Chip-Modules (MCMs) ...

Page 2

... Output Return Loss vs. Temperature 0 -5 -10 -15 -20 - Noise Figure vs. Temperature Order On-line at www.hittite.com HMC562 +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C ...

Page 3

... Gain, Power & Output IP3 vs. Supply Voltage @ 10 GHz, Fixed Vgg +25C +85C -55C Power Compression @ 30 GHz Order On-line at www.hittite.com HMC562 DRIVER AMPLIFIER GHz +25C +85C -55C ...

Page 4

... For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER GHz Typical Supply Current vs. Vdd Vdd (V) +7.5 +8 +8.5 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Order On-line at www.hittite.com HMC562 2 Idd (mA ...

Page 5

... ALL DIMENSIONS IN INCHES [MILLIMETERS] Alternate 2. DIE THICKNESS IS 0.004 (0.100) 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE [2] 4. BOND PAD METALIZATION: GOLD 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 8. OVERALL DIE SIZE IS ±.002 Order On-line at www.hittite.com HMC562 ...

Page 6

... This pad is AC coupled and matched to 50 Ohms Power supply voltage for amplifi er. Not connected. This pad is AC coupled and matched to 50 Ohms Gate control for amplifi er. External bypass capacitors are required. application note. Order On-line at www.hittite.com HMC562 2 Interface Schematic ...

Page 7

... Assembly Diagram 2 Application Circuit For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 v03.0907 GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER GHz Order On-line at www.hittite.com HMC562 ...

Page 8

... Thick GaAs MMIC 0.076mm (0.003”) 0.102mm (0.004”) Thick GaAs MMIC 0.076mm (0.003”) 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC562 2 Ribbon Bond RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Ribbon Bond RF Ground Plane 0.254mm (0.010” ...

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