le9502 Zarlink Semiconductor, le9502 Datasheet - Page 13

• Manufacturer Part Number: le9502
• Description: Ringing Subscriber Line Interface Circuit
• Manufacturer: Zarlink Semiconductor

ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings can cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to absolute maximum ratings for extended periods can affect device reliability.
Note:
Thermal limiting circuitry on chip will shut down the circuit at a junction temperature of about 160ºC. Continuous operation above 145ºC junction
temperature may degrade device reliability.
The thermal performance of a thermally enhanced package is assured through optimized printed circuit board layout. Specified performance re-
quires that the exposed thermal pad be soldered to an equally sized exposed copper surface, which, in turn, conducts heat through 16 0.3 mm
diameter vias on a 1.27 mm pitch to a large (> 500 mm
Le77D112 and Le9502 RSLIC devices, document ID# 081013).
Package Assembly
Green package devices are assembled with enhanced environmental, compatible lead-free, halogen-free, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile.
OPERATING RANGES
Legerity guarantees the performance of this device over commercial (0° to 70°C) and industrial (−40° to 85°C) temperature
ranges by conducting electrical characterization over each range, and by conducting a production test with single insertion
coupled to periodic sampling. These characterization and test procedures comply with section 4.6.2 of Bellcore GR-357-CORE
Component Reliability Assurance Requirements for Telecommunications Equipment.
Environmental Ranges
Electrical Ranges
Ambient Temperature
V
V
V
CC
SW
REG
Storage temperature
Ambient temperature, under bias
V
V
BGND with respect to AGND
A (TIP) or B (RING) to BGND:
Current from A (TIP) or B (RING)
C1 and C2 with respect to AGND
CHCLK
V
Maximum power dissipation,
T
Thermal Data:
Thermal Data:
ESD Immunity (Human Body Model)
A
CC
REG
SW
Continuous
10 ms (F = 0.1 Hz)
1 µs (F = 0.1 Hz)
250 ns (F = 0.1 Hz)
= 85° C (See notes)
In 44-pin eTQFP package
In 44-pin eTQFP package
with respect to AGND
with respect to BGND
2
) internal copper plane. (Refer to Legerity application note Layout Considerations for the
Zarlink Semiconductor Inc.
13
–55 to +150°C
–40° to +85°C
–0.4 to +6.5 V
+0.4 to –115 V
–100 to 100 mV
V
V
V
V
±150 mA
–0.4 to VCC + 0.4 V
AGND to VCC
BGND to +44 V
1.8 W
θ
32° C/W
θ
9.2° C/W
JESD22 Class 1C compliant
JA
JC
REG
REG
REG
REG
–40° to +85° C
3.3 V ± 5%
8 to 40 V
–7 to –110 (0 V in Disconnect state).
–1 to BGND +1
–5 to BGND +5
–10 to BGND +10
–15 to BGND +15