le77d112 Zarlink Semiconductor, le77d112 Datasheet

le77d112

Manufacturer Part Number

le77d112

Description

Manufacturer

Zarlink Semiconductor

Datasheet

1.LE77D112.pdf (1 pages)

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THE ZARLINK VE770 VoSLIC™/VoSLAC™ CHIPSET BRINGS

TOLL-GRADE VOICE QUALITY TO VOIP APPLICATIONS AND

The VoiceEdge™ VE770 Series are high performance, highly programmable,

The products, their speciﬁ cations, services and other information appearing in this publication are subject to change by Zarlink without notice.

DUAL-CHANNEL SLIC/SLAC CHIPSET

INTEGRATES DTMF DETECTION, FREEING UP DSP CYCLES.

integrated chip sets that perform all the functions necessary to create a two-

wire, twisted pair telephone interface from any broadband digital source. The

VE770 Series includes a two channel codec with DTMF generation/detection, and

a dual-channel SLIC device off ered with integrated switching supplies. Together,

the VE770 Series devices operate with minimal external components and include

software to provide a complete system solution.

Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries is believed to be reliable.

ZARLINK, ZL, and the Zarlink logo are trademarks of Zarlink Semiconductor Inc.

VOICE SOLUTIONS

FEATURING

Generation and

Detection

Channel Device

VoSLAC™ Dual

DTMF

Le78D110

Ch 1

Ch 2

PRODUCT

Channel Device

VoSLIC™ Dual

Le77D112

Zarlink provides a world-class suite of

Zarlink's Software Development Kit (SDK) is

development tools to facilitate the inte-

gration of voice into end-user applications

and to signifi cantly reduce design time.

a package of software tools with optional

hardware tools that can be designed using

Legerity voice solutions.

Our VoicePath™ Application Programming

software interface for controlling, super-

vising, and performing line testing using

voice termination devices.

Interface II (VP API-II) provides a standard

Tracker

Supply

Power

Not actual size

Not actual

PREVIEW

SLIC Device

Codec Device

Applications

Features

Benefi ts

Dual channel integrated ringing

Subscriber loop/self loop tests

Worldwide programmability

A-law, m-law, ADPCM or linear

coding

Industry standard interfaces

• PCM/SPI or GCI

Worldwide programmability

DTMF generation/detection

FSK/Caller ID tone generation

Modem/fax tone generation

Low power dissipation

Maximum cost savings at both chip

& system level through reduced

power and optimized density

Minimal power consumption allows

for increased battery back-up time

and smaller batteries

Meets or exceeds requirements of

most voice over broadband system

designs

Advanced test features enable

remote diagnostics that reduce truck

rolls, system maintenance expenses,

and system downtime

One hardware platform enables

worldwide design & distribution

through SW selectable

confi gurations

Provides the shortest SW

development time

Integrated Access Device (IAD)

Network Interface Unit (NIU)

Cable Modem

DSL Modem

Set Top / House Side Boxes

Intelligent PBX

Pair Gain

FXS Cards

Voice over ISDN or T1 / E1

Smart Residential Gateways

VE770

w w w . Z A R L I N K . c o m

SERIES

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