xe1000-bd Mini-Circuits, xe1000-bd Datasheet - Page 3

• Manufacturer Part Number: xe1000-bd
• Description: 2.0-16.0 Gaas Mmic Frequency Divider
• Manufacturer: Mini-Circuits

Mechanical Drawing
Bias Arrangement
RF Out1
RF Out2
2.0-16.0 GHz GaAs MMIC
Frequency Divider
April 2007 - Rev 17-Apr-07
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
(0.021)
(0.013)
(0.033)
0.525
0.325
0.850
2
1
0.0
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Bond Pad #1 (RF Out2)
Bond Pad #2 (RF Out1)
0.0
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
2
1
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
5
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.054 mg.
Tel: [phone] Fax: [phone] mimixbroadband.com
their obligation to be compliant with U.S. Export Laws.
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
XE1000-BD
(Note: Engineering designator is 8SDV0500)
Vcc
Bond Pad #3 (RF In1)
Bond Pad #4 (RF In2)
(0.031)
0.795
5
3
4
RF In1
RF In2
XE1000-BD
Bypass Capacitors
Bond Pad #5 (Vcc)
(0.079)
2.000
3
4
- See App Note [2]
E1000-BD
(0.021)
(0.013)
0.525
0.325
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