CS2A100KC DBLECTRO [DB Lectro Inc], CS2A100KC Datasheet - Page 10

• Manufacturer Part Number: CS2A100KC
• Description: CHIP TYPE, STANDARD
• Manufacturer: DBLECTRO [DB Lectro Inc]

DB LECTRO Inc. 3755 Place Java, Suite 140, Brossard, Québec, J4Y 0E4, Canada - T: 1-450-444-1424 / F: 1-450-444-4714 / www.dblectro.com
LEAD FREE REFLOW SOLDERING CONDITION
(Applicable to Chip Type Aluminum Electrolytic Capacitors)
Recommended Conditions for Reflow Soldering
Classification Reflow Profile
Allowable Range of Peak Temperature
Recommended Land Size (Unit: mm)
Re: (20*) is special for mid-to-high voltage which is HU series.
(1) A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and
(2) Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30
(3) For lead-free type reflow soldering, please observe proper conditions below:
4~ 6.3,
10 10.5L/13.5L
vapor heat transfer systems (VPS) are not recommended.
minutes must be layout between each time.
a) The time of preheating from 150°C to 200°C shall be within maximum 180 seconds;
b) The time of soldering temperature at 217°C measured on capacitors' top shall not exceed
c) The peak temperature on capacitors' top shall not exceed Tp(°C), and the time within 5°C
21 7
20 0
15 0
T p
2 5
12.5,
8 10.5L
Size
tL (second);
of actual peak temperature shall not exceed tp (second).
8 6.2L
16
P re h e a t 1 8 0 s ec Ma x
Thickness (mm)
2 5 to Pe a k * 3
2.5
2.5
2.5
2.5
Ramp-up
T im e
16×16.5/21.5
*1
8×10.5L
8×6.2L
Volume (mm
Size
12.5
Ramp-down
6.3
10
350~2000
350~2000
4
5
tp
>2000
<350
t
L
*2
3
)
Critical Zone
217 t o Tp
1.6
1.6
1.6
2.1
3.0
4.0
4.0
6.0
a
Tp(°C)
250±0
240±0
235±0
230±0
*1. Average ramp-up rate is 3 /second max.
*2. Ramp-down rate is 6 /second max.
*3. Time from 25
2.6
3.0
3.5
4.5
3.5
4.0
5.7
6.5
b
t
L
30 (20*)
(second)
90
90
60
to peak temperature is 8 minutes max.
1.6
1.6
1.6
1.6
2.5
2.5
3.0
3.5
c
tp (second)
5
5
5
5