FMS2301 FORMOSA [Formosa MS], FMS2301 Datasheet - Page 8

• Manufacturer Part Number: FMS2301
• Description: 20V P-Channel Enhancement Mode MOSFET
• Manufacturer: FORMOSA [Formosa MS]

PACKAGE
SOT-23
Suggested thermal profiles for soldering processes
Reel packing
SMD MOSFET
FMS2301
TP
TL
25
1.Storage environment: Temperature=5
2.Reflow soldering of surface-mount devices
3.Reflow soldering
http://www.formosams.com/
TEL:[phone]
FAX:[phone]
REEL SIZE
Tsmin
7"
Average ramp-up rate(T to T )
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t )
Tsmax to T
-Ramp-upRate
Time maintained above:
-Temperature(T )
-Time(t )
Peak Temperature(T )
Time within 5
Temperature(t )
Ramp-down Rate
Time 25
Tsmax
REEL
(pcs)
3000
L
o
Profile Feature
C
to Peak Temperature
L
Preheat
t25 C to Peak
o
C
COMPONENT
P
o
tS
SPACING
L
of actual Peak
(m/m)
4.0
s
P
Time
Ramp-up
L
30,000
(pcs)
BOX
o
P
C
~40
183*183*123
o
Page 8
C
INNER
(m/m)
Humidity=55%±25%
BOX
Tp
Ramp-down
(m/m)
REEL
DIA,
178
Soldering Condition
TL
255
60~260sec
<3
60~120sec
<6
10~30sec
<6minutes
383*262*387
<3
CARTON
o
150
200
o
217
C- + C
o
C
(m/m)
C
SIZE
o
C
/sec
/sec
0/ 5
/sec
o
o
o
C
C
C
Document ID
DS-231129
Critical Zone
Critical Zone
o
TL to TP
TL to TP
Formosa MS
2009/02/10
CARTON
Issued Date
240,000
(pcs)
Revised Date
2011/07/21
GROSS WEIGHT
APPROX.
Revision
(kg)
11.6
C
Page.
8