UGB10GCT GE [General Semiconductor], UGB10GCT Datasheet
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UGB10GCT
Manufacturer Part Number
UGB10GCT
Description
ULTRAFAST SOFT RECOVERY RECTIFIER
Manufacturer
GE [General Semiconductor]
Datasheet
1.UGB10GCT.pdf
(3 pages)
ADVANCED INFORMATION
Ratings at 25°C ambient temperature unless otherwise specified.
Maximum repetitive peak reverse voltage
Working peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) per leg
Maximum instantaneous forward voltage per leg
Maximum reverse leakage current
at working peak reverse voltage
Maximum Reverse recovery time per leg at
I
Maximum reverse recovery time per leg at I
Maximum reverse recovery current per leg at
I
Maximum stored charge per leg
I
Typical thermal resistance from junction to case per leg
Operating junction and storage temperature range
N N O O T T E E : : (1) Pulse test: 300 s pulse width, 1% duty cycle
N N O O T T I I C C E E : : Advanced product information is subject to change without notice
F
F
F
4 4 / / 9 9 8 8
=1.0A, di/dt=100A/ s, V
=5A, di/dt=50A/ s,V
=2A, di/dt=20A/ s, V
Dimensions in inches and (millimeters)
R
R R e e v v e e r r s s e e V V o o l l t t a a g g e e - 300-400 Volts F F o o r r w w a a r r d d C C u u r r r r e e n n t t - 10.0 Amperes
R
=30V
=30V, I
M M A A X X I I M M U U M M R R A A T T I I N N G G S S A A N N D D E E L L E E C C T T R R I I C C A A L L C C H H A A R R A A C C T T E E R R I I S S T T I I C C S S
R
=30V, I
T T O O - - 2 2 6 6 3 3 A A B B
U U G G B B 1 1 0 0 F F C C T T A A N N D D U U G G B B 1 1 0 0 G G C C T T
rr
U U L L T T R R A A F F A A S S T T S S O O F F T T R R E E C C O O V V E E R R Y Y R R E E C C T T I I F F I I E E R R
=0.1 I
rr
=0.1 I
RM
RM
I
F
= 5A
F
=0.5A, I
ADVANCED INFORMATION
C
=100°C
R
=1.0A, I
rr
=0.25A
T
T
T
T
T
J
J
J
J
C
=25°C
=150°C
=25°C
=100°C
=100°C
C C a a s s e e : : JEDEC TO-263AB molded plastic body
T T e e r r m m i i n n a a l l s s : : Plated leads, solderable per MIL-STD-750,
Method 2026
P P o o l l a a r r i i t t y y : : As marked
M M o o u u n n t t i i n n g g P P o o s s i i t t i i o o n n : : Any
M M o o u u n n t t i i n n g g T T o o r r q q u u e e : : 5 in. - lbs. max.
W W e e i i g g h h t t : : 0.08 ounce, 2.24 grams
Flammability Classification 94V-0
correction applications
CECC 802 / Reflow guaranteed
Plastic package has Underwriters Laboratories
Ideally suited for free wheeling diode power factor
Soft recovery characteristics
Excellent high temperature switching
Optimized to reduce switching losses
High temperature soldering in accordance with
Glass passivated chip junction
S S Y Y M M B B O O L L S S
T
V
V
J
V
R
I
V
I
, T
I
FSM
RWM
(AV)
Q
RRM
RMS
V
RM
I
t
t
DC
R
rr
rr
F
rr
JC
STG
M M E E C C H H A A N N I I C C A A L L D D A A T T A A
F F E E A A T T U U R R E E S S
ADVANCED INFORMATION
U U G G B B 1 1 0 0 F F C C T T
300
225
210
300
-40 to +150
1.30
1.05
60A
200
3.0
4.5
10
10
50
35
50
U U G G B B 1 1 0 0 G G C C T T
400
300
280
400
Amps
Amps
Amps
U U N N I I T T S S
°C/W
Volts
Volts
Volts
Volts
Volts
nC
ns
ns
°C
A