12T06A-B NELLSEMI [Nell Semiconductor Co., Ltd], 12T06A-B Datasheet - Page 5
12T06A-B
Manufacturer Part Number
12T06A-B
Description
TRIACs, 12A Snubberless, Logic Level and Standard
Manufacturer
NELLSEMI [Nell Semiconductor Co., Ltd]
Datasheet
1.12T06A-B.pdf
(6 pages)
www.nellsemi.com
1000
Fig.9 Relative variation of critical rate of decrease
Fig.11 Relative variation of critical rate of decrease
100
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
10
6
5
4
3
2
0
1
SEMICONDUCTOR
0.01
0.1
Fig.7 Non-repetitive surge peak on-state current
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
(dI/dt)c [T ] (dl/dt)c [
0
l
TSM
B
of main current versus (dV/dt)c (typical values).
C
dI/dt limitation:
of main current versus junction temperature
50A/µs
for a sinusoidal pulse with width tp < 10ms.
and corresponding value of l t.
(A), l t(A s)
SW
j
25
2
2
0.10
1.0
T specified ]
j
(dV/dt)c (V/µs)
50
t (ms)
p
T (°C)
j
1.00
75
10.0
2
I
TSM
I t
T initial=25°C
2
CW/BW
j
100
10.00
Page 5 of 6
100.0
125
2.5
2.0
1.5
1.0
0.5
0.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
80
70
60
50
30
20
40
10
0
Fig.10 Relative variation of critical rate of
-40
Fig.8 Relative variation of gate trigger current,holding
0.1
0
l
Fig.12 D PAK thermal resistance junction to
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
R
GT H L
th(j-a)
,
current and latching current versus junction
temperature (typical values).
l
I
-20
TW
H
4
,
decrease
(typical values).
D PAK
&
l [T ] / l
(°C/W)
2
I
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35µm)
L
I
GT
2
j
8
0
GT H L
12
,l ,l [T =25°C]
1.0
of main current versus (dV/dt)c
20
(dV/dt)c (V/µs)
12T Series
16
40
S(cm )
j
T (°C)
20
j
2
60
24
10.0
80
28
100
32
120
36
RoHS
RoHS
100.0
140
40