BAP51-02_00 NXP [NXP Semiconductors], BAP51-02_00 Datasheet - Page 2

• Manufacturer Part Number: BAP51-02_00
• Description: General purpose PIN diode
• Manufacturer: NXP [NXP Semiconductors]

Philips Semiconductors
FEATURES
APPLICATIONS
DESCRIPTION
General purpose PIN diode in a SOD523 ultra small SMD
plastic package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
ELECTRICAL CHARACTERISTICS
T
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
2000 Jul 06
V
I
P
T
T
V
V
I
C
r
R
F
j
R
SYMBOL
SYMBOL
D
SYMBOL
stg
j
Low diode capacitance
Low diode forward resistance.
General RF applications.
R
tot
F
R
= 25 C unless otherwise specified.
d
th j-s
General purpose PIN diode
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
forward voltage
reverse voltage
reverse current
diode capacitance
diode forward resistance
thermal resistance from junction to soldering point
PARAMETER
PARAMETER
PARAMETER
I
I
V
V
V
V
I
I
I
T
F
R
F
F
F
s
R
R
R
R
= 50 mA
= 0.5 mA; f = 100 MHz; note 1
= 1 mA; f = 100 MHz; note 1
= 10 mA; f = 100 MHz; note 1
= 10 A
= 90 C
= 50 V
= 0; f = 1 MHz
= 1 V; f = 1 MHz
= 5 V; f = 1 MHz
2
CONDITIONS
PINNING
handbook, halfpage
CONDITIONS
Marking code: K1.
Fig.1 Simplified outline (SOD523) and symbol.
PIN
1
2

1
T op view
50
MIN.
cathode
anode
2
MAM405
0.95
0.4
0.3
0.2
5.5
3.6
1.5
MIN.
TYP.
65
65
Product specification
VALUE
DESCRIPTION
85
BAP51-02
60
50
715
+150
+150
1.1
100
0.55
0.35
9
6.5
2.5
MAX.
MAX.
UNIT
K/W
V
mA
mW
V
V
nA
pF
pF
pF
UNIT
UNIT
C
C