IRLI3705 IRF [International Rectifier], IRLI3705 Datasheet

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IRLI3705

Manufacturer Part Number
IRLI3705
Description
HEXFET Power MOSFET
Manufacturer
IRF [International Rectifier]
Datasheet

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IRLI3705
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IRLI3705N
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Absolute Maximum Ratings
Thermal Resistance
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The TO-220 Fullpak eliminates the need for additional
insulating hardware in commercial-industrial applications.
The moulding compound used provides a high isolation
capability and a low thermal resistance between the tab
and external heatsink. This isolation is equivalent to using
a 100 micron mica barrier with standard TO-220 product.
The Fullpak is mounted to a heatsink using a single clip or
by a single screw fixing.
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
D
D
DM
AR
J
STG
D
GS
AS
AR
@ T
@ T
JC
JA
Logic-Level Gate Drive
Advanced Process Technology
Isolated Package
High Voltage Isolation = 2.5KVRMS
Sink to Lead Creepage Dist. = 4.8mm
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 25°C
= 100°C
on-resistance per silicon area.
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Junction-to-Ambient
Parameter
Parameter
GS
GS
@ 10V
@ 10V
This
G
Typ.
300 (1.6mm from case )
–––
–––
HEXFET
10 lbf•in (1.1N•m)
-55 to + 175
TO-220 FULLPAK
S
D
Max.
0.39
310
± 16
340
5.8
5.0
52
37
58
46
IRLI3705N
®
R
Power MOSFET
DS(on)
Max.
V
2.6
65
DSS
I
D
PD - 9.1369B
= 52A
= 55V
= 0.01
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
8/25/97

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