SKT7 SEMIKRON [Semikron International], SKT7 Datasheet
SKT7
Manufacturer Part Number
SKT7
Description
THYRISTOR
Manufacturer
SEMIKRON [Semikron International]
Datasheet
1.SKT7.pdf
(2 pages)
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SKT 7,0 Qu RG bond.
I
V
Size: 7,0 mm x 7,0 mm
Corner gate
SKT 7,0 Qu RG bond.
Features
• high current density due to double
• high surge current
• compatible to thick wire bonding
• compatible to all standard solder
Typical Applications*
• conrolled rectifier circuits
• solid state relays
© by SEMIKRON
T(DC)
THYRISTOR
RRM
mesa technology
processes
= 75 A
= 1600 V
SKT
Absolute Maximum Ratings
Symbol
V
V
I
I
i
T
Electrical Characteristics
Symbol
V
V
r
I
V
I
V
I
I
Dynamic Characteristics
Symbol
t
(di/dt)
(dv/dt)
Thermal Characteristics
Symbol
T
T
T
R
Mechanical Characteristics
Symbol
Raster
size
Area total
Anode
Gate and
Cathode
Wire bond
Package
Chips /
Package
2
T(AV)
TSM
T
GT
GD
H
L
q
t
jmax
j
stg
solder
RRM
DRM
T
T(TO)
GT
GD
th(j-c)
cr
cr
Rev. 0 – 19.02.2010
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
Conditions
Conditions
Conditions
Conditions
Semipack 1 assembly
Conditions
j
j
c
j
j
j
j
j
j
j
j
j
j
j
j
j
j
= 25 °C, I
= 25 °C, I
= 130 °C, 10 ms, sin 180°
= 130 °C, 10 ms, sin 180°
= 130 °C, I
= 130 °C
= 130 °C
= 25 °C
= 25 °C
= 115 °C
= 130 °C
= 25 °C
= 25 °C
= 130 °C
= 130 °C
= 130 °C
= 80 °C, T
R
D
j
T
= 0.2 mA
= 0.2 mA
= 130 °C
= 45 A
min.
min.
min.
0.25
-40
-40
6
Al,diameter ≤ 500µm
solderable (Ag/Ni)
bondable (Al)
7.0 x 7.0
Values
Values
1600
1600
1010
typ.
typ.
typ.
0.45
450
130
150
tray
55
49
81
max.
max.
max.
1000
0.85
1.98
100
165
330
130
130
255
1.2
7.9
50
Unit
Unit
Unit
Unit
Unit
mm
A/µs
V/µs
mm
K/W
A
mΩ
mA
mA
mA
mA
pcs
°C
°C
°C
°C
µs
V
V
A
A
V
V
V
V
2
s
2
2
1
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SKT7 Summary of contents
Page 1
SKT 7 bond. THYRISTOR T(DC 1600 V RRM Size: 7 7,0 mm Corner gate SKT 7 bond. Features • high current density due to double mesa technology • ...
Page 2
SKT 7 bond. This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested ...