emif02-mic02f3 STMicroelectronics, emif02-mic02f3 Datasheet - Page 7
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emif02-mic02f3
Manufacturer Part Number
emif02-mic02f3
Description
2 Lines Emi Filter Including Esd Protection
Manufacturer
STMicroelectronics
Datasheet
1.EMIF02-MIC02F3.pdf
(8 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
EMIF02-MIC02F3
4
Note:
5
Figure 13. Flip-chip tape and reel specifications
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com.
Ordering information
More information is available in the application notes:
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
Revision history
EMIF02-MIC02F3
17-Jan-2006
Part Number
Date
All dimensions in mm
0.73 +/- 0.05
Revision
1
Dot identifying Pin A1 location
Marking
Initial release.
HB
User direction of unreeling
Package
Flip-Chip
4 +/- 0.1
Changes
4 +/- 0.1
Base qty
5000
Ø 1.5 +/- 0.1
4 Ordering information
Tape & reel (7”)
Delivery mode
7/8