pic-8002ase waitrony, pic-8002ase Datasheet - Page 3

• Manufacturer Part Number: pic-8002ase
• Description: Micro Embedded Infrared Receiver Module
• Manufacturer: waitrony

Die Bonding
Module No.: PIC-8002ASE
Testing Method
Distance
specifies maximum distance that output
waveform satisfies the standard (FIG-3) under
the conditions below against the standard
transmitter.
a. Measuring place
b. Ambient light source
c. Standard transmitter
Embedded Design
This design (Fig-4) is to install a metal case
on the carrier lead frame to cover the
semiconductor components, in order to shield
it electromagnetically within the epoxy resin
encapsulation.
Micro Embedded Infrared Receiver Module
Indoor without extreme reflection of light.
Detecting surface illumination is 200±5Lux
under ordinary white fluorescence lamp of
no high frequency lightning.
Transmitter wave indicated in FIG-2 of
standard transmitter is arranged to satisfy
Vo≥50mVp-p under the measuring circuit
specified in FIG-3
FIG-4 Embedded Design
between
Embedded Cover
Protection
emitter
and
Encapsulation
After
detector
Precautions for Use
a. Store and use where there is no force
b. Store and use where there is no corrosive
c. Store and use where there is no extreme
d. Solder the lead pin within the condition
e. Do not wash this device. Wipe the stains
f. To prevent static electricity damage to the
causing transformation or change in
quality.
gas or sea (salt) breeze.
humidity.
of ratings. After soldering, do not add
exterior force.
of diode side with a soft cloth. You can
use the solvent, ethyl alcohol, or methyl
alcohol only.
pre-amp, make sure that the human body,
the soldering iron are connected to
ground before using.