tfdu6300 Vishay, tfdu6300 Datasheet - Page 9

• Manufacturer Part Number: tfdu6300
• Description: Fast Infrared Transceiver Module Fir, 4 Mbit/s For 2.4 V To 3.6 V Operation
• Manufacturer: Vishay

TFDU6300
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFDU6300 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)-
free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in
figure 6 and 7 are VISHAY's recommended profiles
for use with the TFDU6300 transceivers. For more
details please refer to the application note
“SMD Assembly Instructions”
(http://www.vishay.com/docs/82602/82602.pdf).
A ramp-up rate less than 0.9 °C/s is not
recommended. Ramp-up rates faster than 1.3 °C/s
could damage an optical part because the thermal
conductivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned application note, describing manual
soldering and desoldering.
www.vishay.com
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19535
Figure 5. Recommended Solder Profile for Sn/Pb soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
90 s max.
250
300
350
Storage
The storage and drying processes for all VISHAY
transceivers
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19532
275
250
225
200
175
150
125
100
280
260
240
220
200
180
160
140
120
100
75
50
25
80
60
40
20
0
0
0
0
Figure 6. Solder Profile, RSS Recommendation
2 °C...3 °C/s
50
T ≥ 217 °C for 70 s max
50
T ≥ 255 °C for 10 s....30 s
Figure 7. RTS Recommendation
(TFDUxxxx
100
1.3 °C/s
90 s...120 s
100
T
peak
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
Peak temperature T
= 260 °C max
150
Time/s
Time/s
150
and
200
peak
Document Number 84763
= 260 °C
30 s max.
70 s max.
200
< 4 °C/s
250
TFBSxxx)
Rev. 1.7, 03-Jan-08
T peak = 260 °C
< 2 °C/s
2 °C...4 °C/s
250
300
350
300
are