hpmx-3002 ETC-unknow, hpmx-3002 Datasheet
hpmx-3002
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hpmx-3002 Summary of contents
Page 1
... GSM (Global System for Mobile communications) portable and mobile telephone systems the output stage for other low cost applications such as 900 MHz ISM band spread-spectrum. The HPMX-3002 is fabricated with Hewlett-Packard’s 15 GHz f t ISOSAT-II process, which combines stepper lithography, ion implantation, self-alignment ...
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... Parameters and Test Conditions P Output Power out PCR Power Control Range I Driver Stages Current Output Stage Current CC 2 HPMX-3002 Summary Characterization Information 4 dBm @ 900 MHz, output matched for maximum power CC1 CC2 nom nom. set by V CC1 ...
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... V CC1 ( NOM.) 1000 Figure 1. HPMX-3002 Typical 900 MHz Amplifier Use. has an operating range of 4 nominal). It should be bypassed close to RFIC body using a 1000 pF capacitor. RF (pin 4): in The impedance of this RFIC is well matched to 50 from 100 MHz to 1100 MHz ...
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... +37 +85 +37 30 -40 22 +85 P 1dB 25 21 840 880 920 960 FREQUENCY (MHz) Figure 8. HPMX-3002 one dB Com- pressed Power and Small Signal Gain vs. Frequency and Temperature 2 mA, I CC2 control CC1 30 2.2 V 2 1.6 V 1 ...
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... Loss vs. Frequency 4.5 V CC1 1000 pF PIN 1000 dBm IN ALL TRANSMISSION LINES ARE 50 V CONTROL Figure 14. HPMX-3002 Test Circuit Configuration 200 400 600 800 1000 FREQUENCY (MHz) Figure 12. HPMX-3002 Output Return Loss vs. Frequency CC2 BIAS ...
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... HPMX-3002 Typical Scattering Parameters 4 CC1 CC2 Freq S 11 GHz Mag Ang dB 0.10 0.33 151 42.89 0.20 0.34 92 44.16 0.30 0.31 51 42.95 0.40 0.31 18 42.06 0.50 0.29 -14 41.91 0.60 0.23 -52 42.12 0.70 0.09 -117 41.62 0.80 0.06 66 38.19 0.90 0.16 42 34.23 1.00 0.19 11 29.87 1.10 0.21 6 26.42 HPMX-3002 Typical Scattering Parameters 4 CC1 CC2 Freq S 11 GHz Mag Ang dB 0.10 0.33 143 45.90 0.20 0.31 83 45.15 0.30 0.28 43 43.46 0.40 0.27 11 42.43 0.50 0.25 -21 42.15 0.60 0.19 -63 42.13 0.70 0.05 -144 41.26 0.80 0.09 61 37.86 0.90 0.17 38 34.07 1.00 0.19 12 29.89 1.10 0.21 6 26. ...
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... HPMX-3002 Typical Scattering Parameters 4 CC1 CC2 Freq S 11 GHz Mag Ang dB 0.10 0.26 122 46.64 0.20 0.18 67 43.80 0.30 0.15 30 41.76 0.40 0.12 -1 40.36 0.50 0.08 -30 39.64 0.60 0.02 -112 39.17 0.70 0.13 92 38.03 0.80 0.19 51 35.15 0.90 0.23 34 32.04 1.00 0.24 11 28.44 1.10 0.24 4 25.49 Part Number Ordering Information Part Number Option HPMX-3002 - HPMX-3002 #T10 Package Dimensions S0-8 Package 8 PIN: 1 1.27 (0.050) TYP 0 DEG MIN 8 DEG MAX NOTE: DIMENSIONS ARE IN MILLIMETERS (INCHES). ...
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... HPMX-3002 Test Board Layout OUT V CC2 1 V CC1 Finished board size: 1.5" x 1.5" x 1/32" Material: 1/32" epoxy/fiberglass, 1 oz. copper, both sides, tin/lead coating, both sides. Note: “.” marks indicate drilling locations for plated-through via holes to the groundplane on the bottom side of the board. ...