RF3140PCBA-41X RFMD [RF Micro Devices], RF3140PCBA-41X Datasheet - Page 15

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RF3140PCBA-41X

Manufacturer Part Number
RF3140PCBA-41X
Description
QUAD-BAND GSM850/GSM900/DCS/PCS POWER AMP MODULE
Manufacturer
RFMD [RF Micro Devices]
Datasheet
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is
3μinch to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land and Solder Mask Pattern
Figure 1. PCB Metal Land and Solder Mask Pattern (Top View)
Rev A9 060217
8.39 (mm) Typ.
4.20 (mm) Typ.
7.00 (mm)
5.60 (mm)
2.81 (mm)
1.40 (mm)
0.00
Pin 1
A = 0.80 (mm) Sq. Typ.
A
A
A
A
A
A
A
A
A
Metal Land Pattern
PCB Design Requirements
A
A
A
1.78 (mm)
7.49 (mm) Typ.
6.60 (mm)
6.00 (mm)
5.20 (mm)
5.11 (mm)
3.30 (mm)
3.21 (mm)
2.41 (mm)
0.98 (mm)
0.89 (mm) Typ.
8.39 (mm) Typ.
7.00 (mm) Typ.
5.60 (mm) Typ.
4.20 (mm) Typ.
2.81 (mm) Typ.
1.40 (mm) Typ.
0.00
Pin 1
B = 2.17 x 6.40 (mm)
A = 0.80 (mm) Sq. Typ.
A
A
A
A
A
A
A
Solder Mask Pattern
A
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
A
A
A
RF3140
A
A
A
A
A
A
A
A
A
A
A
A
A
A
4.20 (mm)
2-505

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