RF3163PCBA-41X RFMD [RF Micro Devices], RF3163PCBA-41X Datasheet

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RF3163PCBA-41X

Manufacturer Part Number
RF3163PCBA-41X
Description
3V 900MHZ LINEAR POWER AMPLIFIER MODULE
Manufacturer
RFMD [RF Micro Devices]
Datasheet
Product Description
The RF3163 is a high-power, high-efficiency linear ampli-
fier module specifically designed for 3V handheld sys-
tems. The device is manufactured on an advanced third
generation GaAs HBT process, and was designed for use
as the final RF amplifier in 3V IS-95/CDMA2000-1X/
AMPS/W-CDMA handheld digital cellular equipment,
spread-spectrum systems, and other applications in the
824MHz to 849MHz band. The RF3163 has a digital con-
trol line for low power applications to lower quiescent cur-
rent. The RF3163 is assembled in a 16-pin, 3mmx3mm,
QFN package.
Optimum Technology Matching® Applied
Rev A5 060504
Typical Applications
• 3V CDMA/AMPS Cellular Handset
• 3V CDMA2000/1XRTT Cellular Handset
• 3V W-CDMA US-Cellular Handset
Si BJT
Si Bi-CMOS
InGaP/HBT
VMODE
VREG
RF IN
NC
Functional Block Diagram
1
2
3
4
RoHS Compliant & Pb-Free Product
16
5
GaAs HBT
SiGe HBT
GaN HEMT
Bias
15
6
14
7
0
13
8
GaAs MESFET
Si CMOS
SiGe Bi-CMOS
12
11
10
9
RF OUT
VCC2
VCC2
VCC2
• 3V CDMA2000/1X-EV-DO US-Cellular
• Spread-Spectrum System
Handset
Features
Ordering Information
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
• Input Internally Matched@50Ω
• Output Internally Matched
• 28dBm Linear Output Power
• 41% Peak Linear Efficiency - CDMA
• -51dBc ACPR @ 885kHz
• 55% AMPS Efficiency
RF3163
RF3163PCBA-41XFully Assembled Evaluation Board
Pin 1 ID
0.15 C
2 PLCS
0.15 C
2 PLCS
0.925
0.775
Shaded areas represent pin 1.
Package Style: QFN, 16-Pin, 3x3
3.00
0.203 REF
3V 900MHz Linear Power Amplifier Module
0.102 REF
3V 900MHZ LINEAR POWER
A
B
3.00
0.40
0.20
AMPLIFIER MODULE
0.10
1.45
TYP
M
C
RF3163
C A B
1.45
0.08 C
Dimensions in mm.
http://www.rfmd.com
Fax (336) 664 0454
Tel (336) 664 1233
0.08 C
0.50 TYP
Pin 1 ID
0.05
0.28
0.18
2-689
TYP

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RF3163PCBA-41X Summary of contents

Page 1

... Linear Output Power 13 • 41% Peak Linear Efficiency - CDMA • -51dBc ACPR @ 885kHz 12 RF OUT • 55% AMPS Efficiency 11 VCC2 10 VCC2 Ordering Information 9 VCC2 RF3163 RF3163PCBA-41XFully Assembled Evaluation Board 8 RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA RF3163 3V 900MHZ LINEAR POWER AMPLIFIER MODULE 3.00 1.45 A 3.00 1.45 0.40 B TYP 0 ...

Page 2

RF3163 Absolute Maximum Ratings Parameter Supply Voltage (RF off) ≤31dBm) Supply Voltage (P OUT Control Voltage (V ) REG Input RF Power Mode Voltage (V ) MODE Operating Temperature Storage Temperature Moisture Sensitivity Level (IPC/JEDEC J-STD-20) Parameter Min. High Power ...

Page 3

Parameter Min. High Power Mode - W-CDMA (V Low) MODE Operating Frequency Range Linear Gain Maximum Linear Output Linear Efficiency Maximum I CC ACLR @ 5MHz ACLR @ 10MHz Low Power Mode - W-CDMA (V High) MODE Operating Frequency Range ...

Page 4

RF3163 Pin Function Description connection. Do not connect this pin to any external circuit. 2 VREG Regulated voltage supply for amplifier bias circuit. In power down mode, both V 3 VMODE For nominal operation (High Power mode), ...

Page 5

Evaluation Board Schematic - CDMA VREG C30 4.7 μF VMODE Ω μstrip VCC1 P1 1 GND 2 GND P1-3 3 VCC1 GND 4 P1-5 VCC2 5 CON5 Evaluation Board Schematic - W-CDMA VREG C30 4.7 μF ...

Page 6

RF3163 Electrostatic Discharge Sensitivity Human Body Model (HBM) Figure 3 shows the HBM ESD sensitivity level for each pin to ground. The ESD test is in compliance with JESD22-A114. 2000 V VREG 2000 V VMODE Figure 3. ESD Level - ...

Page 7

PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch to 8μinch gold over 180μinch nickel. PCB Land Pattern Recommendation PCB land patterns for PFMD components are based on ...

Page 8

RF3163 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around ...

Page 9

Carrier tape basic dimensions are based on EIA481. The pocket is designed to hold the part for shipping and loading onto SMT manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. The individual pocket design can ...

Page 10

RF3163 2-698 Rev A5 060504 ...

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