apa2066 Anpec Electronics Corporation, apa2066 Datasheet

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apa2066

Manufacturer Part Number
apa2066
Description
Stereo 1.8-w Audio Power Amplifier
Manufacturer
Anpec Electronics Corporation
Datasheet
APA2066
Features
Applications
Ordering and Marking Information
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright
Rev. A.3- Jun., 2008
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-
020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and
halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
APA2066
APA2066 KA :
Low Supply Current, I
High PSRR (Power Supply Ripple Rejection)
De-pop Circuitry Integrated
Thermal Shutdown Circuitry Integrated
Output Power at 1% THD+N, V
- 1.6 W/Ch (typ) into a 4 Load
- 1.1 W/Ch (typ) into an 8 Load
Bridge-Tied Load (BTL) or Single-Ended (SE)
Modes Operation
Low Shutdown Current, I
Short Circuit Protection
SOP-16P with Thermal Pad Package
Lead Free and Green Devices Available
(RoHS Compliant)
Notebook Computer
LCD Monitor or TV
ANPEC Electronics Corp.
APA2066
XXXXX
DD
= 12mA
DD
=0.5µA
Assembly Material
Handling Code
Temperature Range
Package Code
DD
=5V
1
General Description
The APA2066 is a stereo bridge-tied audio power am-
plifier in 16-pin SOP. When connecting to a 5V voltage
supply, the APA2066 is capable of delivering 1.6W/1.
1W of continuous RMS power per channel into 4/8 loads
with less than 1% THD+N, respectively. The APA2066 sim-
plifies design and frees up board space for other features.
Both of the de-pop circuitry and the thermal shutdown
protection circuitry are integrated in the APA2066, that re-
duces pops and clicks noise during power up and when
using the shutdown or mute modes and protects the chip
from being destroyed by over-temperature failure.To sim-
plify the audio system design in notebook computer
applications, the APA2066 combines a stereo bridge-
tied loads (BTL) mode for speaker drive and a stereo
single-end (SE) mode for headphone drive into a single
chip, where both modes are easily switched by the SE/
BTL input control pin signal. For power sensitive
applications, the APA2066 also features a shutdown
function, which keeps the supply current only 0.5µA (typ).
Stereo 1.8-W Audio Power Amplifier
Package Code
Temperature Range
Handling Code
Assembly Material
KA : SOP-16P
TR : Tape & Reel
L : Lead Free Device
G : Halogen and Lead Free Device
XXXXX - Date Code
I : - 40 to 85 C
www.anpec.com.tw

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apa2066 Summary of contents

Page 1

... DD Both of the de-pop circuitry and the thermal shutdown protection circuitry are integrated in the APA2066, that re- duces pops and clicks noise during power up and when using the shutdown or mute modes and protects the chip from being destroyed by over-temperature failure.To sim- =0.5µ ...

Page 2

... DD Thermal Characteristics Symbol Thermal Resistance from Junction to Ambient in Free Air JA Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 RIN 2 ROUT+ 3 GND 4 APA2066 SOP-16P GND 5 LOUT+ 6 LIN 7 APA2066_PIN_OUT Parameter Parameter Parameter 2 16 RVDD 15 ROUT- 14 SE/BTL 13 GND 12 MUTE 11 LOUT- 10 SHUTDOWN 9 LVDD Rating -0. -0. -40°C to 85°C Internal Limited -65° ...

Page 3

... 1.4W, BTL 0.9W, BTL 78mW, SE 10, THD+N < APA2066 Unit Min. Typ. Max. 4 900 - nA - 900 - 1 APA2066 Unit Min. Typ. Max. - 2 1.6 - 1.1 - 650 - 400 mW - 500 - 320 - - 90 0 0.15 0.02 - >20 - kHz www.anpec.com.tw ...

Page 4

... Note3 : Output power is measured at the output terminals of the IC at 1kHz. Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 = 25° (unless otherwise noted Test Conditions BTL Open Load 100 Hz, BTL f = 100 Hz 500 mW, BTL mode 4 APA2066 Unit Min. Typ. Max ° ...

Page 5

... APA2066 Typical Operating Characteristics THD+N vs. Output Power f=1kHz BTL 0.1 0.01 0 0.5 1 1.5 Output Power (W) THD+N vs. Output Power BTL f=20kHz 1 f=1kHz f=20Hz 0.1 0.05 10m 100m Output Power (W) Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 ...

Page 6

... APA2066 Typical Operating Characteristics (Cont.) THD+N vs. Output Power =330 =16 L 0.1 0.01 0.001 0 50m 100m Output Power (W) THD+N vs. Output Power =1000 0.1 0.01 0.001 1m 10m Output Power (W) Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 ...

Page 7

... APA2066 Typical Operating Characteristics (Cont.) THD+N vs. Frequency =1.5W O BTL 0.1 0.05 20 100 Frequency (Hz) THD+N vs. Frequency =1W O BTL 1 A = 0.05 20 100 Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 0.1 0.05 20k 1k 10k ...

Page 8

... APA2066 Typical Operating Characteristics (Cont.) THD+N vs. Frequency =120mW O C =1000 0 = 0.001 20 100 1k Frequency (Hz) THD+N vs. Frequency =75mW O C =1000 0 = 0.001 20 100 Frequency (Hz) Copyright ANPEC Electronics Corp ...

Page 9

... APA2066 Typical Operating Characteristics (Cont.) Frequency Response +20 +19 Gain +18 +17 +16 +15 +14 Phase + =1.5W +11 O BTL +10 10 100 1k Frequency (Hz) Crosstalk vs Frequency + =1.5W O BTL -40 -60 -80 -100 20 100 1k Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 ...

Page 10

... APA2066 Typical Operating Characteristics (Cont.) PSRR vs. Frequency + BTL -20 -30 -40 -50 -60 -70 -80 -90 -100 20 100 Frequency (Hz) Noise Floor vs. Frequency 100 V = BTL 20 Filter BW < 22kHz 10 A-Weighting 100 1k Frequency (Hz) Copyright ANPEC Electronics Corp. ...

Page 11

... APA2066 Typical Operating Characteristics (Cont.) Supply Current vs. Supply Voltage 15.0 No Load 12.0 9.0 6.0 3.0 0.0 3.0 3.5 4.0 4.5 Supply Voltage (Voltage) Power Dissipation vs. Output Power 200 V =5V 180 DD SE 160 140 120 100 100 150 Output Power (mW) Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 BTL SE 5 ...

Page 12

... APA2066 Pin Description PIN I/O NAME NO RBYPASS 1 - Connect to voltage divider for right channel internal mild-supply bias. RIN 2 I Right channel line input. ROUT Right channel positive output in BTL mode and SE mode. GND 4,5,13 - Ground connection for circuitry, directly connected to thermal pad LOUT + ...

Page 13

... APA2066 Block Diagram RIN RBYPASS SE/BTL SHUTDOWN LIN LBYPASS MUTE Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 - + 20k SE/BTL 20k - SHUTDOWN + - + 20k 20k - MUTE + APA2066_BLOCK 13 ROUT+ ROUT- LOUT+ LOUT- www.anpec.com.tw ...

Page 14

... 0.1 F RIN - RBYPASS + 20k LIN - LBYPASS + C 20k B SE/BTL SHUTDOWN MUTE GND R 20k 100 F O ROUT 20k SE/BTL Circuit + ROUT- 100 F C LOUT 10k LOUT- APA2066_APP_CKT www.anpec.com.tw Control Pin Ring Sleeve Tip Headphone Jack ...

Page 15

... Four times the output power is possible as compared amplifier under the same conditions. A BTL configuration, such as the one used in APA2066, also creates the second advantage over SE amplifiers. Since the differential outputs, ROUT+, ROUT-, LOUT+, and LOUT-, are biased at half-supply, no need DC voltage exists across the load ...

Page 16

... APA2066 Application Information (Cont.) Output SE/BTL Operation The ability of the APA2066 to easily switch between BTL and SE modes is one of its most important costs saving features. This feature eliminates the requirement for an additional headphone amplifier in applications where in- ternal stereo speakers are driven in BTL mode but exter- nal headphone or speakers must be accommodated ...

Page 17

... Shutdown Function source inside the In order to reduce power consumption while not in using, the APA2066 contains a shutdown pin to externally turn off the amplifier bias circuitry. This shutdown feature turns the amplifier off when a logic high is placed on the SHUTDOWN pin. The trigger point between a logic high and logic low level is typically 2 ...

Page 18

... APA2066 Application Information (Cont.) Optimizing Depop Circuitry Circuitry has been included in the APA2066 to minimize the amount of popping noise at power-up when coming out of shutdown mode. Popping occurs whenever a volt- age step is applied to the speaker. In order to eliminate clicks and pops, all capacitors must be fully discharged before turn-on ...

Page 19

... Rev. A.3- Jun., 2008 are not properly addressed, the APA2066 will go into ther- mal shutdown when driving a 4 The thermal pad on the bottom of the APA2066 should be soldered down to a copper pad on the circuit board. Heat can be conducted away from the thermal pad through the copper plane to ambient ...

Page 20

... Table 2 shows that for some applications no airflow is required to keep junction temperatures in the specified range. The APA2066 is designed with a thermal shut- down protection that turns the device off when the junc- tion temperature surpasses 150°C to prevent damaging the IC ...

Page 21

... APA2066 Package Information SOP-16P D D1 EXPOSED PAD MIN 0.00 A2 1.25 b 0.31 c 0.17 D 9.80 D1 3.50 5. 3.80 E2 2. Note : 1. Follow from JEDEC MS-012 BC. 2. Dimension "D" does not include mold flash, protrusions 3. Dimension "E" does not include inter-lead flash or protrusions. ...

Page 22

... APA2066 Carrier Tape & Reel Dimensions K0 SECTION A-A Application A H 330.0± 2.00 50 MIN SOP-16P 4.0± 0.10 8.0± 0.10 Devices Per Unit Package Type SOP-16P Copyright ANPEC Electronics Corp. Rev. A.3- Jun., 2008 P0 P2 OD0 A0 OD1 B SECTION B 16.4+2.00 13.0+0.50 1.5 MIN. -0.00 -0. 1.5+0.10 2.0± 0.10 1.5 MIN. -0.00 Unit Tape & Reel ...

Page 23

... APA2066 Reflow Condition Tsmax Tsmin 25 Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Classification Reflow Profiles Profile Feature Average ramp-up rate ( Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: ...

Page 24

... APA2066 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness <2.5 mm 2.5 mm Table 2. Pb-free Process – Package Classification Reflow Temperatures Package Thickness <1.6 mm 1.6 mm – 2 Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0 C ...

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