pe42632 Peregrine Semiconductor Corp., pe42632 Datasheet - Page 3

• Manufacturer Part Number: pe42632
• Description: Sp6t Ultracmos 2.70 V Switch 100 ? 3000 Mhz, 50
• Manufacturer: Peregrine Semiconductor Corp.

PE42632
Product Brief
Table 4. Pin Descriptions
Note:
Table 6. Ordering Information
Document No. 70-0226-01 │ www.psemi.com
Contact [e-mail] for full version of datasheet
Pin No.
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
EK-42632-01
PE42632DTI
PE42632DBI
Order Code
8. Blocking capacitors needed only when non-zero DC
voltage present
Pin Name
ANT
GND
RX1
RX2
RX3
RX4
GND
GND
GND
GND
TX1
TX2
V
V3
V2
V1
DD
8
8
8
8
8
8
8
PE42632-DIE-D
PE42632-DIE-400G
PE42632-DIE-1H
RX Ground
DC Ground
DC Ground
DC Ground
RF I/O – TX1
TX Ground
RF I/O – TX2
RF I/O – RX1
RF I/O – RX2
RF I/O – RX3
RF I/O – RX4
Switch control input, CMOS logic level
Switch control input, CMOS logic level
Switch control input, CMOS logic level
Supply
RF Common - Antenna
Description
Description
Bumped Wafer on Film Frame
Die in Waffle Pack
Evaluation Kit
Package
Figure 4. Pad Configuration (Top View)
Table 5. Truth Table
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
GND
V
V1
V2
V3
ANT – RX1
ANT – RX2
ANT – RX3
ANT – RX4
DD
ANT - TX1
ANT - TX2
©2007 Peregrine Semiconductor Corp. All rights reserved.
Path
Wafer (Gross Die / Wafer Quantity)
400 Dice / Waffle Pack
1/ box
12
11
10
9
8
RX4
GND ANT
13
15
16
7
Shipping Method
PE42632 Die
GND
GND
RX3
14
6
RX2
5
V3
0
0
1
0
1
0
1
2
3
4
TX1
GND
TX2
RX1
V2
1
0
1
1
0
0
Page 3 of 4
V1
1
1
0
0
0
0