SCH-V SHARP [Sharp Electrionic Components], SCH-V Datasheet

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SCH-V

Manufacturer Part Number
SCH-V
Description
8 M-bit (1 MB x 8) Smart 5
Manufacturer
SHARP [Sharp Electrionic Components]
Datasheet

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Part Number:
SCH-V940
Manufacturer:
NXP
Quantity:
12 122
DESCRIPTION
The LH28F008SC-V/SCH-V flash memories with
Smart 5 technology are high-density, low-cost,
nonvolatile, read/write storage solution for a wide
range of applications. Their symmetrically-blocked
architecture, flexible voltage and enhanced cycling
capability provide for highly flexible component
suitable for resident flash arrays, SIMMs and memory
cards. Their enhanced suspend capabilities provide
for an ideal solution for code + data storage
applications. For secure code storage applications,
such as networking, where code is either directly
executed out of flash or downloaded to DRAM, the
LH28F008SC-V/SCH-V
protection : absolute protection with V
selective hardware block locking, or flexible software
block locking. These alternatives give designers
ultimate control of their code security needs.
FEATURES
• Smart 5 technology
• High performance read access time
COMPARISON TABLE
LH28F008SC-V/SCH-V
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books,
etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LH28F008SC-V
LH28F008SCH-V
LH28F008SC-V85/SCH-V85
LH28F008SC-V12/SCH-V12
– 5 V V
– 5 V or 12 V V
– 85 ns (5.0±0.25 V)/90 ns (5.0±0.5 V)
– 120 ns (5.0±0.5 V)
VERSIONS
CC
PP
offer
OPERATING TEMPERATURE
three
–25 to +85
0 to +70
PP
levels
at GND,
˚
C
˚
C
of
- 1 -
• Enhanced automated suspend options
• Enhanced data protection features
• SRAM-compatible write interface
• High-density symmetrically-blocked architecture
• Enhanced cycling capability
• Low power management
• Automated byte write and block erase
• ETOX
• Packages
ETOX is a trademark of Intel Corporation.
– Byte write suspend to read
– Block erase suspend to byte write
– Block erase suspend to read
– Absolute protection with V
– Flexible block locking
– Block erase/byte write lockout during power
– Sixteen 64 k-byte erasable blocks
– 100 000 block erase cycles
– 1.6 million block erase cycles/chip
– Deep power-down mode
– Automatic power saving mode decreases I
– Command user interface
– Status register
– 40-pin TSOP Type I (TSOP040-P-1020)
– 44-pin SOP (SOP044-P-0600)
– 48-ball CSP (FBGA048-P-0608)
transitions
in static mode
TM
V
V nonvolatile flash technology
CC
8 M-bit (1 MB x 8) Smart 5
deep power-down current (MAX.)
DC CHARACTERISTICS
Normal bend/Reverse bend
LH28F008SC-V/SCH-V
10 µA
20 µA
Flash Memories
PP
= GND
CC

Related parts for SCH-V

SCH-V Summary of contents

Page 1

... LH28F008SC-V/SCH-V DESCRIPTION The LH28F008SC-V/SCH-V flash memories with Smart 5 technology are high-density, low-cost, nonvolatile, read/write storage solution for a wide range of applications. Their symmetrically-blocked architecture, flexible voltage and enhanced cycling capability provide for highly flexible component suitable for resident flash arrays, SIMMs and memory cards ...

Page 2

... RY/BY GND GND (FBGA048-P-0608 LH28F008SC-V/SCH-V TOP VIEW CE ...

Page 3

... BUFFER ADDRESS LATCH X DECODER ADDRESS COUNTER DQ - OUTPUT INPUT BUFFER BUFFER IDENTIFIER REGISTER STATUS REGISTER DATA COMPARATOR Y GATING 16 64 k-BYTE BLOCKS - 3 - LH28F008SC-V/SCH-V I LOGIC CE# WE# COMMAND USER INTERFACE OE# RP# RY/BY# WRITE V STATE PP PROGRAM/ERASE MACHINE VOLTAGE SWITCH V CC GND ...

Page 4

... HH ≤ RP# ≤ V produce spurious results and should not be attempted. HH (see Section 6.2.3 "DC CHARACTERISTICS") produce spurious results PP ≤ LH28F008SC-V/SCH-V enables setting of the HH ≤ memory PP PPLK , all write attempts to the flash memory LKO voltage (see Section 6.2.3 "DC ...

Page 5

... This datasheet contains LH28F008SC-V/SCH-V specifications. Section 1 provides a flash memory overview. Sections and 5 describe the memory organization and functionality. Section 6 covers electrical specifications. LH28F008SC-V/ SCH-V flash memories documentation also includes ordering information which is referenced in Section 7. 1.1 New Features LH28F008SC-V/SCH-V Smart 5 flash memories ...

Page 6

... The access time the V AVQV voltage range of 4.75 to 5.25 V over the temperature range +70˚C (LH28F008SC-V)/ –25 to +85˚C (LH28F008SCH-V). At 4 the access time 120 ns. CC The Automatic Power Saving (APS) feature substantially reduces active current when the device is in static mode (addresses not switching) ...

Page 7

... The first task is to write the appropriate read mode command (Read Array, Read Identifier Codes, or Read Status Register) to the CUI. Upon initial device power-up or after exit from deep power- down mode, the device automatically resets to read - 7 - LH28F008SC-V/SCH-V power supply PP . The device PPH1/2 either ...

Page 8

... SHARP allow proper CPU initialization following a system reset through the use of the RP# input. In this application, RP# is controlled by the same RESET# signal that resets the system CPU. is required PHQV - 8 - LH28F008SC-V/SCH-V is required PHWL ) before another IH s flash memories ’ ...

Page 9

... Placing V successful block erase, byte write and lock-bit configuration operations. Device operations are selected by writing specific commands into the CUI. Table 3 defines these commands. Block LH28F008SC-V/SCH-V , the CUI additionally controls block voltage ≤ read operations PPLK on V enables PPH1/2 ...

Page 10

... Command writes involving block erase, byte write, or lock-bit configuration are reliably executed when V voltages. V PPH1/2 PPH1/2 lock-bit configuration with V spurious results and should not be attempted. 7. Refer to Table 3 for valid D ’ 8. Don t use the timing both OE# and WE# are LH28F008SC-V/SCH-V ADDRESS V DQ RY/BY# 0 OUT X X ...

Page 11

... Clear Block Lock-Bits command can be done while RP Commands other than those shown above are reserved by SHARP for future device implementations and should not be used. to enable LH28F008SC-V/SCH-V (NOTE 9) SECOND BUS CYCLE (NOTE 3) (NOTE 1) (NOTE 2) Data Oper ...

Page 12

... FFH). Block preconditioning, erase, and verify are handled internally by the WSM (invisible to the system). After the two-cycle block erase sequence is written LH28F008SC-V/SCH-V voltage. RP voltage. RP# can PP ...

Page 13

... At this point, a Read Array command can be written to read data from blocks other than that which is suspended. A Byte Write command sequence can also be issued during erase suspend to program data in other blocks. Using the Byte - 13 - LH28F008SC-V/SCH the absence of this PP PPH1/2 , status register bits SR.3 and SR.4 will ...

Page 14

... Fig. 7). The CPU can detect the completion of the set lock- bit event by analyzing the RY/BY# pin output or status register bit SR. LH28F008SC-V/SCH-V must remain at PP (the same V level used for byte write) PP ...

Page 15

... active transition, block lock-bit values are left in an undetermined state. A repeat of clear block lock-bits is required to initialize block lock-bit contents to known values. Once the master lock-bit is set, it cannot be cleared LH28F008SC-V/SCH-V and clear block PP PPH1/2 ≤ PPLK ...

Page 16

... Reading the block lock and master lock configuration codes after writing the Read Identifier Codes command indicates master and block lock-bit status. SR.0 is reserved for future use and should be masked out when polling the status register LH28F008SC-V/SCH-V EFFECT BWSS DPS level ...

Page 17

... Command Sequence SR. Error 0 1 Block Erase SR.5 = Error 0 Block Erase Successful Fig. 3 Automated Block Erase Flowchart LH28F008SC-V/SCH-V BUS COMMAND COMMENTS OPERATION Data = 20H Write Erase Setup Addr = Within Block to be Erased Erase Data = D0H Write Confirm Addr = Within Block to be Erased ...

Page 18

... SR.1 = Device Protect Error 0 1 SR.4 = Byte Write Error 0 Byte Write Successful Fig. 4 Automated Byte Write Flowchart LH28F008SC-V/SCH-V BUS COMMAND COMMENTS OPERATION Setup Data = 40H Write Byte Write Addr = Location to be Written Data = Data to be Written Write Byte Write Addr = Location to be Written ...

Page 19

... Fig. 5 Block Erase Suspend/Resume Flowchart BUS COMMAND OPERATION Erase Write Suspend Read Standby Standby Erase Write Resume Read - 19 - LH28F008SC-V/SCH-V COMMENTS Data = B0H Addr = X Status Register Data Addr = X Check SR WSM Ready 0 = WSM Busy Check SR Block Erase Suspended 0 = Block Erase Completed Data = D0H Addr = X ...

Page 20

... Write FFH Read Array Data No Done Reading Yes Write D0H Write FFH Read Byte Write Resumed Array Data Fig. 6 Byte Write Suspend/Resume Flowchart LH28F008SC-V/SCH-V BUS COMMAND COMMENTS OPERATION Data = B0H Byte Write Write Addr = X Suspend Status Register Data Read Addr = X Check SR ...

Page 21

... Command Sequence SR. Error 0 1 Set Lock-Bit SR.4 = Error 0 Set Lock-Bit Successful Fig. 7 Set Block and Master Lock-Bit Flowchart LH28F008SC-V/SCH-V BUS COMMAND COMMENTS OPERATION Set Data = 60H Block/Master Write Addr = Block Address (Block), Lock-Bit Device Address (Master) Setup Set Data = 01H (Block), ...

Page 22

... Device Protect Error 0 1 Command Sequence SR. Error 0 1 Clear Block Lock-Bits SR.5 = Error 0 Clear Block Lock-Bits Successful Fig. 8 Clear Block Lock-Bits Flowchart LH28F008SC-V/SCH-V BUS COMMAND COMMENTS OPERATION Clear Block Data = 60H Write Lock-Bits Addr = X Setup Clear Block Data = D0H Write Lock-Bits ...

Page 23

... Then, the operation will abort and the device will enter deep power-down. The aborted operation may leave data partially altered. Therefore, the System command sequence must be repeated after normal - 23 - LH28F008SC-V/SCH power supply PP CC supply traces and ...

Page 24

... RP# is first raised to V 6.2.4 through 6.2.6 "AC CHARACTERISTICS - READ-ONLY and WRITE OPERATIONS" and Fig. 12, Fig. 13 and Fig. 14 for more information. when V is LKO PP will inhibit LH28F008SC-V/SCH-V standby or sleep modes and t wake-up cycles PHQV PHWL . See Section IH ...

Page 25

... LH28F008SC-V During Read, Block Erase, Byte Write and Lock-Bit Configuration ........ 0 to +70°C Temperature under Bias ............. –10 to +80°C • LH28F008SCH-V During Read, Block Erase, Byte Write and Lock-Bit Configuration ... –25 to +85°C Temperature under Bias ............. –25 to +85°C Storage Temperature ........................ –65 to +125°C Voltage On Any Pin , and RP#) .... – ...

Page 26

... TTL IH (Standard Testing Configuration) Test Configuration Capacitance Loading Value TEST CONFIGURATION V = 5.0±0. 5.0±0 NOTE : 1. Applied to high-speed products, LH28F008SC-V85 and LH28F008SCH-V85 OUT LH28F008SC-V/SCH-V UNIT CONDITION 0 0.0 V OUT 1.5 OUTPUT = 5.0±0. 2.0 OUTPUT 0.8 (0. for a Logic "0". Input timing ...

Page 27

... CE ±2 ±15 µ 200 µA 1 0.1 5 µ 200 µ LH28F008SC-V/SCH-V TEST CONDITIONS Max GND Max GND OUT CC CMOS Inputs Max. CC ...

Page 28

... RP erase, byte write, and lock-bit configuration operations are not guaranteed with V be attempted. (min.), between 9. RP# connection PPH1 (max.). maximum cumulative period of 80 hours. PPH2 to CCR - 28 - LH28F008SC-V/SCH-V TEST UNIT CONDITIONS Min ...

Page 29

... See Fig. 10 "Transient Input/Output Reference Waveform" and Fig. 11 "Transient Equivalent Testing after the falling Load Circuit" (Standard Configuration) for testing GLQV . characteristics LH28F008SC-V/SCH-V (NOTE 1) (NOTE 5) (NOTE 5) LH28F008SC-V85/ LH28F008SC-V12/ LH28F008SCH-V85 LH28F008SCH-V12 MIN. MAX. MIN. MAX. 90 120 90 120 90 120 400 400 45 50 ...

Page 30

... V IH WE# ( High Z DATA (D/Q) ( RP# ( Fig Waveform for Read Operations Device Data Valid Address Selection Address Stable t AVAV t ELQV t GLQV t GLQX t ELQX Valid Output t AVQV t PHQV - 30 - LH28F008SC-V/SCH-V t EHQZ t GHQZ t OH High Z ...

Page 31

... Load Circuit" (High Seed Configuration) for testing characteristics. 6. See Fig. 10 "Transient Input/Output Reference for block erase, Waveform" and Fig. 11 "Transient Equivalent Testing IN Load Circuit" (Standard Configuration) for testing characteristics LH28F008SC-V/SCH-V (NOTE 6) (NOTE 6) LH28F008SC-V85/ LH28F008SC-V12/ LH28F008SCH-V85 LH28F008SCH-V12 MIN. MAX. MIN. MAX. 90 120 100 100 ...

Page 32

... Write Read Array command. Fig Waveform for WE#-Controlled Write Operations (NOTE 3) (NOTE AVAV AVWH WHAX t WHEH t WHGL t t WHWL WHQV1/2/3/4 t WLWH t DVWH t WHDX WHRL t PHHWH t VPWH - 32 - LH28F008SC-V/SCH-V (NOTE 5) (NOTE 6) Valid D IN SRD t QVPH t QVVL ...

Page 33

... Load Circuit" (High Seed Configuration) for testing characteristics. 6. See Fig. 10 "Transient Input/Output Reference for block erase, Waveform" and Fig. 11 "Transient Equivalent Testing IN Load Circuit" (Standard Configuration) for testing characteristics LH28F008SC-V/SCH-V (NOTE 6) (NOTE 6) LH28F008SC-V85/ LH28F008SC-V12/ LH28F008SCH-V85 LH28F008SCH-V12 MIN. MAX. MIN. MAX. 90 120 100 100 ...

Page 34

... Read status register data. 6. Write Read Array command. Fig Waveform for CE#-Controlled Write Operations (NOTE 3) (NOTE AVEH EHAX t EHWH t EHGL t t EHEL EHQV1/2/3/4 t ELEH t DVEH t EHDX EHRL t PHHEH t VPEH - 34 - LH28F008SC-V/SCH-V (NOTE 5) (NOTE 6) Valid D IN SRD t QVPH t QVVL ...

Page 35

... NOTE , reset time RP# going high until outputs are valid. 4. When the device power-up, holding RP#-low minimum 100 ns is required after V range and also has been in stable there LH28F008SC-V/SCH 5.0±0 UNIT MIN. MAX. 100 ns 12 µs ...

Page 36

... C ˚ NOTE MIN. TYP. 2 6.5 2 0.4 2 0.9 2 9.5 2 0.9 3. These performance numbers are valid for all speed versions. 4. Sampled, not 100% tested LH28F008SC-V/SCH-V (NOTE 5.0±0 12.0±0 (NOTE 1) (NOTE 1) MAX. MIN. TYP. MAX. 8 TBD 4.8 6 TBD 0.5 TBD 0.3 0.4 TBD 1 ...

Page 37

... C = Smart 5 Technology Operating Temperature Blank = –25 to +85 C OPTION ORDER CODE 1 LH28F008SCXX-V85 2 LH28F008SCXX-V12 LH28F008SC-V/SCH-V Access Speed (ns (5.0 0.25 V (5.0 0.5 V 120 ns (5.0 0.5 V) Limited Voltage Option only CC Package T = 40-pin TSOP (I) (TSOP040-P-1020) Normal bend R = 40-pin TSOP (I) (TSOP040-P-1020) Reverse bend ...

Page 38

TSOP (TSOP040-P-1020 0.3 20.0 0.2 18.4 0.3 19.0 PACKAGING Package base plane ...

Page 39

SOP (SOP044-P-0600 0.4 0 0.1 0.15 M 1.27 TYP 0.2 28.2 PACKAGING 0.15 0.05 Package base plane ...

Page 40

CSP (FBGA048-P-0608) B 0.1 S TYP. 0.8 TYP. 0 0.1 S TYP. 0 0.2 8 TYP. 1.2 0.03 0. PACKAGING Land ...

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