tva0300n04w3s EMC Technology, tva0300n04w3s Datasheet - Page 6

• Manufacturer Part Number: tva0300n04w3s
• Description: Temperature Variable Attenuator
• Manufacturer: EMC Technology

EMC Technology 8851 SW Old Kansas Ave. Stuart FL 34997 [phone] [phone] www.emct.com
W3 Configuration
Planar Configuration
General Specifications
8
Metallization Options
• Planar (no code)
• Triple Wrap (W3)
• Single Wrap (W1)
• Pretinned (S)
• Lead Free (F)
• Single Wrap (WB1) (MTVA Series only) Metallization
• Gold (G)
W1/WB1 Configuration
Planar device for flip chip mount-
ing offers the best RF performance
and lowest cost.
Metallization wraps around input,
output, and ground terminals.
Permits inspectable solder fillets
when flip chip mounting. See
Application Note 004 on page 66.
Metallization wraps around
ground terminal only. Full backside
metallization.
Pretinned (with Sn 62) terminals
improve solderability (available on
all of the above options).
Lead free, pure tin plating options
are available (excludes WB1 and G
metallization options).
wraps around ground terminal
only. Full backside metallization.
Input and output terminals have
wire bondable gold metallization.
(MTVA and HTVA Series only)
Planar device with gold
metallization. Typically used for
wirebonding.
Thermopad
A Smiths Group company
®