C1206H124C1GACTU KEMET [Kemet Corporation], C1206H124C1GACTU Datasheet

C1206H124C1GACTU

Manufacturer Part Number

C1206H124C1GACTU

Description

Manufacturer

KEMET [Kemet Corporation]

Datasheet

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KEMET’s New High Temperature Surface Mount C0G MLCCs feature a robust and proprietary base metal

dielectric system that offers industry-leading performance relative to capacitance and case size combined with

capacitance stability at extreme temperatures up to +200ºC. This new platform promotes downsizing opportu-

nities of existing High Temperature C0G technology, and offers replacement opportunities of existing X7R/BX/

BR technologies.

Standard capacitance ratings for these devices range from 0.5 pF up to 0.22 μF in capacitance tolerance offer-

ings of ±0.25pF, ±0.5pF, ±1%, ±2%, ±5%, ±10%, or ±20%. The Temperature Coefﬁ cient of Capacitance (TCC)

is ±30ppm/°C from -55°C to +200°. Devices are available in DC voltage ratings of 10V, 16V, 25V, 50V and

100V, with a maximum dissipation factor of 0.10%. Seven standard EIA case size options are available which

include –0603, 0805, 1206, 1210, and 1812- with either nickel barrier/tin or Sn/Pb terminations.

Outline Drawing

Dimensions - Millimeters (Inches)

EIA SIZE

CODE

0603

0805

1206

1210

1812

SIZE CODE

METRIC

1608

2012

3216

3225

4532

Surface Mount Ceramic Chip Capacitors

High Temperature 200ºC C0G MLCC

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

4.5 (.177) ± .30 (.012)

LENGTH

1.25 (.049) ± .20 (.008)

0.8 (.032) ± .15 (.006)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

3.2 (.126) ± .30 (.012)

No Piezoelectric Noise.

Extremely low ESR and ESL.

High Thermal Stability.

High Ripple Current Capability.

Preferred capacitance solution at line frequencies and into the MHz range.

No capacitance change with respect to applied rated DC voltage.

Minimal capacitance change with respect to temperature from -55ºC to +200ºC.

No capacitance decay with time.

Non-polar device.

Typical applications include critical timing, tuning, circuits requiring low loss,

circuits with pulse, high current, decoupling, by-pass, ﬁ ltering, transient voltage

suppression, blocking and energy storage for use in extreme environments com-

monly present in applications such as down-hole exploration, aerospace engine

compartments and geophysical probes.

WIDTH

Product Bulletin

Beneﬁ ts and Features:

0.35 (.014) ± .15 (.006)

0.50 (.020) ± .25 (.010)

0.60 (.024) ± .35 (.014)

Applications:

BANDWIDTH

SEPARATION

0.75 (.030)

minimum

0.7 (.028)

F4002 01/10

N/A

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C1206H124C1GACTU Summary of contents

Page 1

Surface Mount Ceramic Chip Capacitors High Temperature 200ºC C0G MLCC KEMET’s New High Temperature Surface Mount C0G MLCCs feature a robust and proprietary base metal dielectric system that offers industry-leading performance relative to capacitance and case size combined with capacitance ...

Page 2

Ordering Information C 1210 H Case Size Speciﬁ cation/ Capacitance Code Ceramic (L”x W”) Series 0603 H = High Temp (200ºC) 0805 1206 1210 *Use 9 for 1.0 - 9.9pF 1812 *Use 8 for 0.5 - .99pF ex. 2.2pF = ...

Page 3

Electrical Characteristics Delta Cap vs. Temperature (Typical - -15 100% Vr -20 Temperature (ºC) Capacitance vs. Temperature with 25V DC bias (Rated Voltage) 200 200ºC C0G 100nF no DC 200ºC C0G 100nF ...

Page 4

High Temperature 200ºC (0603 - 1812 Case Sizes) C0G DIELECTRIC Series C0603 Voltage Cap Cap pF Code Voltage Code Cap Tolerance 0.50-0.75 508-759 1.0-2.4 109-249 2.7 ...

Page 5

Chip Thickness / Packaging Quantities Packaging Quantity Based on Finished Chip Thickness Speciﬁ cations Thickness Chip Code Size AA 01005 AB 0201 BB 0402 CB 0603 CC 0603 CD 0603 DB 0805 DC 0805 DD 0805 DE 0805 DF 0805 ...

Page 6

Soldering Process All parts incorporate the standard KEMET barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resistance to leaching. HMP solders ,e.g., Pb94, are recommended for high temperature applications. Marking ...

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