CLD-AP90 CREE [Cree, Inc], CLD-AP90 Datasheet - Page 8
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CLD-AP90
Manufacturer Part Number
CLD-AP90
Description
Manufacturer
CREE [Cree, Inc]
Datasheet
1.CLD-AP90.pdf
(11 pages)
ChemiCalS & Conformal CoaTingS
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a
complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical
Compatibility Application Note (www.cree.com/products/pdf/XLamp_Chemical_Comp.pdf). The video at www.youtube.
com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and
materials with LEDs. You should also consult your regional Cree Field Applications Engineer.
recommended Cleaning Solutions
Cree has found the following chemicals to be safe to use with XLamp XB-D LeDs.
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Chemicals Tested as harmful
In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals
to be harmful to XLamp XB-D LeDs. Cree recommends not using these chemicals anywhere in an LeD system containing
XLamp XB-D LeDs. The fumes from even small amounts of the chemicals may damage the LeDs.
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potential of Silver Tarnishing
XLamp XB-D LeDs contain silver plated parts that may tarnish (turn black) over time when exposed to oxidizing
substances such as sulfur, chlorine, or other halogen compounds. Oxidation of the leads can reduce the ability to make a
good solder connection and affect the light output of the LeD. exposure to oxidizing substances can come from materials
used near the LeD during manufacturing or from the air around the LeDs during storage.
To reduce the potential of tarnishing for XLamp XB-D LeDs, Cree recommends that customers minimize exposure of
the LeDs to oxidizing substances at all times, including dry box storage, manufacturing and product testing. Potential
sources of oxidizing substances include paper, air filters, some cleaning chemicals, cardboard boxes and rubber anti-
static mats.
Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
of Cree, Inc.
www.cree.com.
Water
Isopropyl alcohol (IPA)
Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
Methyl acetate or ethyl acetate (i.e., nail polish remover)
Cyanoacrylates (i.e., “Superglue”)
Glycol ethers (including Radio Shack® Precision electronics Cleaner - dipropylene glycol monomethyl ether)
Formaldehyde or butadiene (including Ashland PLIOBOND® adhesive)
xlamp xB-D leD solDering & hanDling
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