CLD-DS41_12 CREE [Cree, Inc], CLD-DS41_12 Datasheet - Page 10

• Manufacturer Part Number: CLD-DS41_12
• Manufacturer: CREE [Cree, Inc]

thermal desiGn
The maximum forward current is determined by the thermal resistance between the LeD junction and ambient. It is
crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optimize lamp life and optical characteristics.
refloW solderinG characteristics
In testing, Cree has found XLamp XT-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
of Cree, Inc.
marks of Cree, Inc.
1600
1400
1200
1000
800
600
400
200
0
0
T
T
25
Rj-a = 10°C/W
Rj-a = 15°C/W
Rj-a = 20°C/W
Rj-a = 25°C/W
P
L
Ts
Ts
20
max
min
40
Preheat
Ambient Temperature (ºC)
ts
t 25˚C to Peak
60
Time
Ramp-up
80
Ramp-down
t
P
100
t
S
120
Critical Zone
T
L
to T
P
140
xlamp xT-E lEDs
10
10