SQS24H01FS7 BITECH [Bi technologies], SQS24H01FS7 Datasheet - Page 2
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SQS24H01FS7
Manufacturer Part Number
SQS24H01FS7
Description
HSTL Termination Circuit Thin Film Resistor Networks
Manufacturer
BITECH [Bi technologies]
Datasheet
1.SQS24H01FS7.pdf
(3 pages)
POWER DERATING CURVE
MECHANICAL
PACKAGE POWER, WATTS @ 70°C, MAX.
Lead Plating
Lead Material
Lead Configuration
Lead Coplanarity
Substrate Material
Resistor Material
Body Material
TOLERANCES
Accuracy Code
Absolute Resistance Tolerances at 25°C
Ratio Tolerances at 25°C
Temperature Coefficient of Resistance (TCR Code)
Temperature Coefficient of Resistance, Tracking
Power per resistor @ 70°C, Max. is 100mW, not to exceed package power.
Percent of
Rated Power
100
80
60
40
20
0
-0
4-90
QSOP 24
1.0
70
Degrees C
1.0%
1.0%
F
125
150
NiCr on Si - HSTL Circuit
2.0%
N/A
G
Passivated Nichrome
0.004” (0.102mm)
±100ppm/°C (S)
80/20 Tin Lead
Molded Epoxy
±5ppm/°C
Copper Alloy
5.0%
Gull Wing
N/A
J
Silicon