BPW049-0830-07CB95 ACTEL [Actel Corporation], BPW049-0830-07CB95 Datasheet - Page 2

• Manufacturer Part Number: BPW049-0830-07CB95
• Description: SE-CSG49, E-Tec lead free prototype socket drawing for CSG49 and CSG49 packages
• Manufacturer: ACTEL [Actel Corporation]

8
Ball / Land Grid Array Sockets
Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed
and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional
board space. The 1.27mm pitch screw lock socket extends ≈ 6,00 mm beyond the outer ball row with
no fixing holes.
We aim to solve your requirements - many different terminals and configurations are available.
Your custom sets our standards!
Please note, we will always request the chip data to ensure we offer a compatible socket.
PCB Pad Layout
B
L
C
Device Type
Ø 0,60mm/.024“ if pitch 1,27mm
Ø 0,50mm/.020“ if pitch 1,00mm
Ø 0,40mm/.016“ if pitch 0,80mm
Ø 0,35mm/.014“ if pitch 0,75mm
Ø 0,35mm/.014“ if pitch 0,65mm
Ø 0,30mm/.012“ if pitch 0,50mm
The pitch dimension depends on your Ball Grid Array
=
=
=
Nbr of contacts
ballcount of chip
Ball Grid
Land Grid
Column Grid
depends on
SMT Style
PCB Hole Layout
EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries.
E-tec is now the leading BGA socket manufacturer.
Twist Lock Type
C
P
U
Device Material
small diameter solderballs
Soldertail Style
=
=
=
30 = standard SMT...
29 = raised SMT..
28 = special raised SMT - only for 1.00 & 0.80mm pitch….....
70 = standard solder tail……..…...….
X X W x x x x - x x x x - x x X X
You may request any specific socket dimension from
std. socket for
ceramic device
std. socket for
plastic device
socket adapted to
Ø 0,42mm/.016” if pitch 1,27mm
Ø 0,29mm/.011” if pitch 1,00mm
Ø 0,29mm/.011” if pitch 0,80mm
Ø 0,27mm/.010” if pitch 0,75mm
Ø 0,27mm/.010” if pitch 0,65mm
Ø 0,27mm/.010” if pitch 0,50mm
Ø 0,60mm/.024” if pitch 1,27mm
Ø 0,50mm/.020” if pitch 1,00mm
Ø 0,40mm/.016” if pitch 0,80mm
Ø 0,35mm/.014” if pitch 0,75mm
Ø 0,35mm/.014” if pitch 0,65mm
Ø 0,35mm/.014” if pitch 0,50mm
pls. ref. to separate catalog page
For top view socket dimension
PCB solder hole:
Soldertail:
[e-mail]
( „A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm pitch; 2,80mm if 0,80mm pitch, 2.30mm if <0.80mm pitch )
( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm pitch, 0.60 if 0,80mm pitch; 0,40mm if <0.80mm pitch )
05 = 0,50mm
06 = 0,65mm
07 = 0,75mm
08 = 0,80mm
How to order
Pitch
( „A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if <0.80mm pitch )
10 = 1,00mm
12 = 1,27mm
15 = 1,50mm
others on
request
Mechanical data
Contact life
Retention System life
Solderability
Individual contact force
Max. torque for retention screws
Material
Insulator
Terminal
Contact
Electrical data
Contact resistance
Current rating
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz
Capacitance
Inductance
Operating temperature
Torque limiting screw driver
Solder paste
Solder profile
Contact Type
Important Note:
Please check the ball diameters & heights of your chip prior to
ordering the standard E-tec BGA (BPW, BCW) sockets. Any deviation
has to be communicated to E-tec in order to check compatibility with
the standard socket design and if necessary to obtain a special order
code adapted to your chip dimensions.
The standard solderball diameters & heights are the following:
Pitch
0.50mm
0.65mm
0.75mm
0.80mm
1.00mm
1.27mm & 1.50mm
a) plastic chips (
b) ceramic chips
If the minimum ball diameter of a given chip falls below the above
(RoHS compliant)
(RoHS compliant)
(RoHS compliant)
indications, then a BUW socket will generally be proposed.
Grid Code Config Code
( „A“ = 4,50mm )
will be given by the factory
after receipt of the chip
95
BPW)
(BCW)
Recommendations
datasheet
Specifications
10.000 cycles min.
1.000 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
up to 800 pins = 7cNm or 10 oz-inch
as of 800 pins = 7cNm to 10cNm or 10 oz
High temp plastic or epoxy FR4
Brass
BeCu
< 100 m
500 mA max.
100 MΩ
500 MΩ
500V min.
< 1 pF
< 2 nH
−55°C to +125°C ; 260°C for 60 sec.
L
Refer to page “Tools” of this catalog
Please use a solder paste w/o any silver!
Please refer to our website
0.25mm / 0.35mm
0.25mm / 0.45mm
0.25mm / 0.45mm
0.40mm / 0.55mm
0.50mm / 0.70mm
0.60mm / 1.00mm
0.60mm / 1.00mm
ball diameters
Ω
if 0.50 to 0.80mm pitch
1.00mm pitch upwards
min/max
optional for locating pegs
to 14 oz-inch
95
www.e-tec.com
0.15mm / 0.30mm
0.15mm / 0.30mm
0.15mm / 0.40mm
0.25mm / 0.45mm
0.30mm / 0.50mm
0.50mm / 0.70mm
0.80mm / 1.00mm
ball height
Plating
min/max
= tin/gold
(tin leadfree)