BPW272-1270-20AC11 ACTEL [Actel Corporation], BPW272-1270-20AC11 Datasheet - Page 3

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BPW272-1270-20AC11

Manufacturer Part Number
BPW272-1270-20AC11
Description
272-27 x 27mm, 1.27mm E-TEC BGA SOCKET
Manufacturer
ACTEL [Actel Corporation]
Datasheet
38
Ball / Land Grid Array Sockets
Sockets range from 5 x 5 upwards contacts with even larger parts
currently in design. Some of the existing patterns are shown on the
following pages, many more exist and your exact requirements can easily
be added to our extensive product library. The SMD socket is simply
placed and reflowed onto the PCB in the same way as the chip and
occupies only a small amount of additional board space. The screw lock
socket extends ≈ 6,00 mm beyond the outer ballrow with no fixing holes.
We aim to solve your requirements - many different terminals and
configurations are available. Your custom sets our standards!
B
L
C
Device Type
Ø 0,70mm/.028“ if pitch 1,27mm
Ø 0,60mm/.023“ if pitch 1,00mm
Ø 0,50mm/.019“ if pitch 0,80mm
= Ball Grid
= Land Grid
= Column Grid
Please note, we will always request the chip data
The pitch dimension depends on your Ball Grid Array
PCB Hole Layaut
PCB Pad Layout
SMT Style
to ensure we offer a compatible socket.
E-tec is now the leading BGA socket manufacturer.
Screw Lock Type
Nbr of contacts
refer to the next pages
Soldertail Style
Device Material
C
P
X X W x x x x - x x x x - x x X X x x
=
=
Ø 0,45mm/.017“ if pitch 1,27mm
Ø 0,45mm/.017“ if pitch 1,00mm
Ø 0,40mm/.015“ if pitch 0,80mm
Ø 0,60mm/.024“ if pitch 1,27mm
Ø 0,60mm/.024“ if pitch 1,00mm
Ø 0,55mm/.021“ if pitch 0,80mm
Ceramic
Plastic
dimensions if BGA Socket pitch 1,27mm with contact type 30
PCB Hole:
Soldertail:
30 = standard SMD
29 = raised SMD
70 = solder tail
07
08
10
12
15
How to order
Pitch
= 0,75mm
= 0,80mm
= 1,00mm
= 1,27mm
= 1,50mm
EP patents 0829188, 0897655
Patents pending in other countries.
Mechanical data
Contact life
Retention System life
Solderability
Individual contact force
Max. torque for retention screws
Material
Insulator
Terminal
Contact
Electrical data
Contact resistance
Current rating
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz
Inductance
Operating temperature
( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm & 0,80mm pitch )
( „A“ = 5,00mm; other dim. on request )
( „A“ = 3,30mm if 1,27mm pitch; 2,80mm if 1,00mm & 0,80mm pitch )
Grid Code Config Code
please refer to
the footprint
42 to 50
Contact Type
pages
receipt of the chip
Specifications
will be given by
the factory after
datasheet
100000 cycles min.
100 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
7 cN per meter, or 10oz per inch
Glass Epoxy FR 4
Brass
BeCu
< 30 m
1 A max.
>10
1 KV min.
< 5 nH
−55°C to +130°C ; 220°C for 10 sec.
4
MΩ
E-tec
the Swiss connection
01 = tin/gold
Plating

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