HLMP-C115_05 HP [Agilent(Hewlett-Packard)], HLMP-C115_05 Datasheet - Page 11

• Manufacturer Part Number: HLMP-C115_05
• Description: T-13/4 Super Ultra-Bright LED Lamps
• Manufacturer: HP [Agilent(Hewlett-Packard)]

Precautions
Lead Forming
Soldering Conditions
11
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
Figure 8. Recommended wave soldering profile.
250
200
150
100
50
30
0
10
FLUXING
TURBULENT WAVE
PREHEAT
20
30
TIME – SECONDS
40
Wave Soldering
105 C Max.
30 sec Max.
250 C Max.
3 sec Max.
50
60
70
LAMINAR WAVE
HOT AIR KNIFE
80
Manual Solder
Dipping
–
–
260 C Max.
5 sec Max.
90
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
Note:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)