HLMP-FW00 AVAGO [AVAGO TECHNOLOGIES LIMITED], HLMP-FW00 Datasheet - Page 5

• Manufacturer Part Number: HLMP-FW00
• Description: 5mm Flat Top InGaN White LED Lamp
• Manufacturer: AVAGO [AVAGO TECHNOLOGIES LIMITED]

Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• It is recommended that tooling made to precisely form
Soldering Condition:
• Care must be taken during PCB assembly and soldering
• The closest LED is allowed to solder on board is
• Recommended soldering condition:
Recommended Wave Soldering Profile
5
250
200
150
100
length prior to insertion and soldering into PC board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
and cut the leads to length rather than rely upon hand
operation.
process to prevent damage to LED component.
1.59mm below the body (encapsulant epoxy) for those
parts without standoff.
50
30
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
0
10
FLUXING
20
PREHEAT
Wave
Soldering
105 °C Max.
30 sec Max
50 °C Max.
3 sec Max.
TURBULENT WAVE
30
40
TIME - SECONDS
Manual
Solder Dipping
-
-
60 °C Max.
5 sec Max
50
60
70
• Wave soldering parameter must be set and maintain
• If necessary, use fixture to hold the LED component
• Proper handling is imperative to avoid excessive
• Special attention must be given to board fabrication,
• Recommended PC board plated through holes
Note: Refer to application note AN1027 for more information on
soldering LED components.
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
in proper orientation with respect to the PCB during
soldering process.
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25ûC before handling.
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
LED component
ead size
0.457 x 0.457mm
(0.018 x 0.018inch)
0.508 x 0.508mm
(0.00 x 0.00inch)
LAMINAR WAVE
80
HOT AIR KNIFE
90
100
Diagonal
0.646 mm
(0.05 inch)
0.718 mm
(0.08 inch)
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
Plated through
hole diameter
0.976 to 1.078 mm
(0.038 to 0.04 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)