PCF8576 Philips Semiconductors, PCF8576 Datasheet - Page 34

• Manufacturer Part Number: PCF8576
• Description: Universal LCD driver for low multiplex rates
• Manufacturer: Philips Semiconductors

Philips Semiconductors
12.1
In chip-on-glass technology, where driver devices are
bonded directly onto glass of the LCD, it is important that
the devices may be cascaded without the crossing of
conductors, but the paths of conductors can be continued
on the glass under the chip. All of this is facilitated by the
PCF8576 bonding pad layout (see Fig.30). Pads needing
bus interconnection between all PCF8576s of the cascade
are V
lines may be led to the corresponding pads of the next
PCF8576 through the wide opening between V
13 BONDING PAD LOCATIONS
1998 Feb 06
handbook, full pagewidth
Universal LCD driver for low multiplex
rates
Bonding pad dimensions: 120
DD
Chip-on-glass cascadability in single plane
, V
SS
, V
LCD
, CLK, SCL, SDA and SYNC. These
4.12
mm
120 m.
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
33
52
53
32
Fig.30 Bonding pad locations.
LCD
31
54
pad
55
30
x
29
56
PCF8576
3.07 mm
28
34
1
0
y
0
and the backplane output pads. The only bus line that does
not require a second opening to lead through to the next
PCF8576 is V
of V
connected together.
When an external clocking source is to be used, OSC of all
devices should be connected to V
The pads OSC, A0, A1, A2 and SA0 have been placed
between V
hardware subaddress and slave address.
27
2
LCD
26
3
25
4
adjacent to V
SS
24
5
and V
LCD
23
6
cascade
centre
, being the cascade centre. The placing
DD
22
7
SS
MBK282
to facilitate wiring of oscillator,
19
18
17
16
15
14
13
allows the two supplies to be
21
20
12
11
10
9
8
S3
S2
S1
S0
BP3
BP1
BP2
BP0
V LCD
V SS
SA0
A2
DD
.
Product specification
PCF8576