DAC7541 Burr-Brown Corporation, DAC7541 Datasheet - Page 3

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DAC7541

Manufacturer Part Number
DAC7541
Description
Low Cost 12-Bit CMOS Four-Quadrant Multiplying DIGITAL-TO-ANALOG CONVERTER
Manufacturer
Burr-Brown Corporation
Datasheet

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ABSOLUTE MAXIMUM RATINGS
NOTE: (1) Stresses above those listed above may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at
these or any other condition above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
The DAC7541A is an ESD (electrostatic discharge) sensi-
tive device. The digital control inputs have a special FET
structure, which turns on when the input exceeds the supply
by 18V, to minimize ESD damage. However, permanent
damage may occur on unconnected devices subject to high
energy electrostatic fields. When not in use, devices must be
stored in conductive foam or shunts. The protective foam
should be discharged to the destination socket before
devices are removed.
BURN-IN SCREENING
Burn-in screening is an option available for the models in the
Ordering Information table. Burn-in duration is 160 hours at
the indicated temperature (or equivalent combination of time
and temperature).
All units are tested after burn-in to ensure that grade speci-
fications are met. To order burn-in, add “-BI” to the base
model number.
ORDERING INFORMATION
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
MODEL
DAC7541AJP
DAC7541AKP
DAC7541AJU
DAC7541AKU
BURN-IN SCREENING OPTION
See text for details.
MODEL
DAC7541AJP-BI
DAC7541AKP-BI
V
V
V
Digital Input Voltage (pins 4-15) to Ground ............................... –0.4V, V
V
Power Dissipation (any Package):
Lead Temperature (soldering, 10s) ................................................ +300 C
Storage Temperature: Plastic Package ......................................... +125 C
DD
REF
RPB
PIN 1
To +75 C ..................................................................................... 450mW
Derates above +75 C .............................................................. –6mW/ C
(Pin 16) to Ground ...................................................................... +17V
(Pin 17) to Ground ..................................................................... +25V
(Pin 18) to Ground ..................................................................... 25V
, V
PIN 2
ELECTROSTATIC
DISCHARGE SENSITIVITY
to Ground ............................................................. –0.4V, V
Plastic SOIC
Plastic SOIC
PACKAGE
PACKAGE
Plastic DIP
Plastic DIP
Plastic DIP
Plastic DIP
(1)
TEMPERATURE
TEMPERATURE
0 C to +70 C
0 C to +70 C
0 C to +70 C
0 C to +70 C
0 C to +70 C
0 C to +70 C
RANGE
RANGE
DD
DD
ACCURACY (LSB)
ACCURACY (LSB)
RELATIVE
RELATIVE
3
1/2
1/2
1/2
1
1
1
PIN CONNECTIONS
PACKAGE INFORMATION
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
MODEL
DAC7541JP
DAC7541KP
DAC7541JU
DAC7541KU
DAC7541JP-BI
DAC7541KP-BI
Top View
Bit 1 (MSB)
GAIN ERROR (LSB)
BURN-IN TEMP.
(160 Hours)
I
I
GND
OUT 1
OUT 2
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
+85 C
+85 C
6
1
6
1
Plastic SOIC
Plastic SOIC
1
2
3
4
5
6
7
8
9
PACKAGE
Plastic DIP
Plastic DIP
Plastic DIP
Plastic DIP
(1)
DAC7541A
DAC7541A
18
17
16
15
14
13
12
11
10
PACKAGE DRAWING
R
V
+V
Bit 12 (LSB)
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
NUMBER
FB
REF
DD
218
218
219
219
218
218
(1)
DIP/SOIC
®

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