TICP206D Power Innovations Limited, TICP206D Datasheet

no-image

TICP206D

Manufacturer Part Number
TICP206D
Description
SILICON TRIACS
Manufacturer
Power Innovations Limited
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TICP206D-S
Manufacturer:
BOURNS
Quantity:
1 001
electrical characteristics at 25°C case temperature (unless otherwise noted)
† All voltages are with respect to Main Terminal 1.
Copyright © 1997, Power Innovations Limited, UK
absolute maximum ratings over operating case temperature (unless otherwise noted)
NOTES: 1. These values apply bidirectionally for any value of resistance between the gate and Main Terminal 1.
P R O D U C T
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
Repetitive peak off-state voltage (see Note 1)
Full-cycle RMS on-state current at (or below) 85°C case temperature (see Note 2)
Peak on-state surge current full-sine-wave (see Note 3)
Peak on-state surge current half-sine-wave (see Note 4)
Peak gate current
Average gate power dissipation at (or below) 85°C case temperature (see Note 5)
Operating case temperature range
Storage temperature range
Lead temperature 1.6 mm from case for 10 seconds
I
I
V
DRM
GTM
GTM
LP with fomed leads
1.5 A RMS
Glass Passivated Wafer
400 V to 600 V Off-State Voltage
Max I
Package Options
2. This value applies for 50-Hz full-sine-wave operation with resistive load. Above 85°C derate linearly to 110°C case temperature at
3. This value applies for one 50-Hz full-sine-wave when the device is operating at (or below) the rated value of on-state current.
4. This value applies for one 50-Hz half-sine-wave when the device is operating at (or below) the rated value of on-state current.
5. This value applies for a maximum averaging time of 20 ms.
PARAMETER
PACKAGE
Repetitive peak off-
state current
Peak gate trigger
current
Peak gate trigger
voltage
the rate of 60 mA/°C.
Surge may be repeated after the device has returned to original thermal equilibrium. During the surge, gate control may be lost.
Surge may be repeated after the device has returned to original thermal equilibrium. During the surge, gate control may be lost.
GT
LP
of 10 mA
I N F O R M A T I O N
Tape and Reel
PACKING
V
V
V
V
V
V
V
V
V
Bulk
D
supply
supply
supply
supply
supply
supply
supply
supply
= rated V
= +12 V†
= +12 V†
= -12 V†
= -12 V†
= +12 V†
= +12 V†
= -12 V†
= -12 V†
RATING
DRM
PART # SUFFIX
(None)
R
I
R
R
R
R
R
R
R
R
G
L
L
L
L
L
L
L
L
TEST CONDITIONS
= 0
= 10
= 10
= 10
= 10
= 10
= 10
= 10
= 10
t
t
t
t
t
t
t
t
p(g)
p(g)
p(g)
p(g)
p(g)
p(g)
p(g)
p(g)
TICP206M
TICP206D
MT2
MT1
> 20 s
> 20 s
> 20 s
> 20 s
> 20 s
> 20 s
> 20 s
> 20 s
MT2
MT1
G
G
WITH FORMED LEADS
LP PACKAGE
LP PACKAGE
(TOP VIEW)
(TOP VIEW)
MARCH 1988 - REVISED MARCH 1997
SYMBOL
I
P
V
T(RMS)
I
I
I
T
TSM
TSM
G(AV)
DRM
T
GM
T
stg
C
L
MIN
SILICON TRIACS
TICP206 SERIES
TYP
-40 to +110
-40 to +125
1
2
3
1
2
3
VALUE
±0.2
400
600
230
1.5
0.3
10
12
MAX
-2.5
-2.5
±20
2.5
2.5
10
-8
-8
8
MDC2AA
MDC2AB
UNIT
UNIT
mA
°C
°C
°C
W
V
V
A
A
A
A
A
1

Related parts for TICP206D

TICP206D Summary of contents

Page 1

... TICP206 SERIES SILICON TRIACS MARCH 1988 - REVISED MARCH 1997 LP PACKAGE (TOP VIEW MT2 2 3 MT1 LP PACKAGE WITH FORMED LEADS (TOP VIEW MT2 2 3 MT1 SYMBOL VALUE TICP206D 400 V DRM TICP206M 600 I 1.5 T(RMS TSM I 12 TSM I ±0 0.3 G(AV) T -40 to +110 ...

Page 2

TICP206 SERIES SILICON TRIACS MARCH 1988 - REVISED MARCH 1997 electrical characteristics at 25°C case temperature (unless otherwise noted) (continued) PARAMETER Peak on-state ± voltage V supply I Holding current H V supply V ...

Page 3

HOLDING CURRENT vs CASE TEMPERATURE 100 V = ± Initiating supply + - 0·1 -60 -40 - Case Temperature - °C C Figure 3. ...

Page 4

TICP206 SERIES SILICON TRIACS MARCH 1988 - REVISED MARCH 1997 LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature ...

Page 5

LP003 (TO-92) 3-pin cylindical plastic package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable ...

Page 6

TICP206 SERIES SILICON TRIACS MARCH 1988 - REVISED MARCH 1997 LPR tape dimensions LP Package (TO-92) Tape (Formed Lead Version) 3,43 MIN. 32,00 27,68 23,00 16,50 17,66 15, ...

Page 7

... Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current. PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty ...

Related keywords