MT41J128M8 MDTIC [Micon Design Technology Corporation], MT41J128M8 Datasheet - Page 100

• Manufacturer Part Number: MT41J128M8
• Description: 1Gb: x4, x8, x16 DDR3 SDRAM
• Manufacturer: MDTIC [Micon Design Technology Corporation]

Figure 47: Change Frequency During Precharge Power-Down
PDF: 09005aef826aa906/Source: 09005aef82a357c3
1Gb_DDR3_4.fm - Rev. D 8/1/08 EN
DQS, DQS#
Command
Address
ODT
CK#
CKE
DM
DQ
CK
NOP
T0
t AOFPD/ t AOF
t IH
t CH
t CK
power-down mode
Notes:
Enter precharge
t CL
t IS
NOP
Previous clock frequency
T1
t CPDED
been satisfied, the DLL must be reset via the MRS. Depending on the new clock
frequency, additional MRS commands may need to be issued. During the DLL lock time,
R
ready to operate with a new clock frequency. This process is depicted in Figure 47.
1. Applicable for both slow-exit and fast-exit precharge power-down modes.
2.
3. If the R
High-Z
High-Z
TT
t
tion (ODT)" on page 160 for exact requirements).
power-down mode, the ODT signal must be continuously registered LOW ensuring R
an off state. If the R
charge power-down mode, R
tered either LOW or HIGH in this case.
AOFPD and
_
t CKSRE
NOM
NOP
T2
and R
TT
_
NOM
t
Ta0
TT
AOF must be satisfied and outputs High-Z prior to T1 (see "On-Die Termina-
feature was enabled in the mode register prior to entering precharge
t CKE
_
Frequency
WR
change
TT
Tb0
must remain in an off state. After the DLL lock time, the DRAM is
_
NOM
feature was disabled in the mode register prior to entering pre-
100
t CKSRX
TT
Tc0
t IH
will remain in the off state. The ODT signal can be regis-
t CH
b
t CK
power-down mode
b
Exit precharge
t CL
b
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t IS
NOP
Tc1
1Gb: x4, x8, x16 DDR3 SDRAM
New clock frequency
NOP
t XP
Td0
t CH
b
t CK
b
t CL
DLL RESET
b
MRS
Td1
©2006 Micron Technology, Inc. All rights reserved.
Indicates A Break in
Time Scale
t DLLK
NOP
Te0
t IH
t CH
Commands
b
t CK
b
t CL
b
t IS
Valid
Valid
Te1
Don’t Care
TT
is in