LMV1015-15 NSC [National Semiconductor], LMV1015-15 Datasheet - Page 4

• Manufacturer Part Number: LMV1015-15
• Manufacturer: NSC [National Semiconductor]

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Connection Diagram
Note: - Pin numbers are referenced to package marking text orientation.
Ordering Information
Note: All packages are supplied with large dome bump technology for 1kg adhesion criteria.
4-Bump Extreme Thin
(0.3 mm max height)
(0.4 mm max height)
4-Bump Ultra-Thin
lead free only
lead free only
- The actual physical placement of the package marking will vary slightly from part to part. The package will designate the date code and will vary considerably.
Package marking does not correlate to device type in any way.
micro SMD
micro SMD
Package
LMV1015XRX-15
LMV1015XRX-25
LMV1015URX-15
LMV1015URX-25
LMV1015UR-15
LMV1015UR-25
LMV1015XR-15
LMV1015XR-25
Part Number
Large Dome 4-Bump micro SMD
Package Marking
Date Code
Date Code
Top View
4
20128903
250 Units Tape and Reel
250 Units Tape and Reel
250 Units Tape and Reel
250 Units Tape and Reel
3k Units Tape and Reel
3k Units Tape and Reel
3k Units Tape and Reel
3k Units Tape and Reel
Transport Media
NSC Drawing
URA04ADA
XRA04ADA