TDA9981BHL/15/C1XX NXP [NXP Semiconductors], TDA9981BHL/15/C1XX Datasheet - Page 38

• Manufacturer Part Number: TDA9981BHL/15/C1XX
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
17. Soldering: additional information
18. Abbreviations
TDA9981B_1
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
The package of this device supports the reflow soldering process only.
Table 29.
Acronym
AC-3
ADC
AV
CEC
CMOS
DAC
DDC
DENC
DSP
DTS
DVD
DVI
EAV
E-EDID
HBM
HDMI
Fig 23. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Active Coding-3
Analog-to-Digital Converter
Audio Video
Consumer Electronics Control
Complementary Metal-Oxide Semiconductor
Digital-to-Analog Converter
Display Data Channel
Digital video ENCoder
Digital Signal Processor
Digital Theater Systems
Digital Versatile Disc
Digital Visual Interface
End of Active Video
Enhanced Extended Display Identification Data
Human Body Model
High-Definition Multimedia Interface
Rev. 01 — 4 July 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
150 MHz pixel rate HDMI transmitter
temperature
peak
TDA9981B
© NXP B.V. 2008. All rights reserved.
001aac844
time
38 of 41