EP2C8 ALTERA [Altera Corporation], EP2C8 Datasheet

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EP2C8

Manufacturer Part Number
EP2C8
Description
Cyclone Series Device Thermal Resistance
Manufacturer
ALTERA [Altera Corporation]
Datasheet
1.EP2C8.pdf (7 pages)

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Revision
History
Altera Corporation
DS-CYTHRML-3.0
May 2008, version 3.0
March 2007
April 2006
May 2008
May 2007
July 2007
Date
f
Document Version
The following table shows the revision history for this data sheet.
Tables 1
thermal resistance) and θ
for Altera
FineLine
BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC),
Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP),
Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).
3.0
2.2
2.1
2.0
1.0
For additional packaging information, refer to the
Data
Sheet.
through
®
®
BGA (FBGA), Micro FineLine BGA
Cyclone
Updated
Updated values for EP3C25 (E144) device in Table 2.
Updated values for EP3C10 (E144) device in Table 2 and added
Revision History.
Added Cyclone III information.
Initial release.
6
in this data sheet provide θ
®
Tables
series devices available in Ball-Grid Array (BGA),
JC
2, 4, and 5.
(junction-to-case thermal resistance) values
Cyclone Series Device
Thermal Resistance
Changes Made
®
JA
(MBGA), Ultra FineLine
(junction-to-ambient
Altera Device Packaging
Data Sheet
1

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EP2C8 Summary of contents

Page 1

May 2008, version 3.0 Revision The following table shows the revision history for this data sheet. History Date Document Version May 2008 3.0 July 2007 2.2 May 2007 2.1 March 2007 2.0 April 2006 1.0 Tables 1 thermal resistance) and ...

Page 2

Cyclone III Thermal resistance values for Cyclone III devices are provided for a board meeting JEDEC specifications and for a typical board. The JEDEC board Devices specifications require two signals and two power/ground planes and are available at www.jedec.org. The ...

Page 3

Altera Device Package Information Data Sheet Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part Device Package EP3C16 E144 Q240 F256 U256 U484 F484 M164 EP3C25 E144 Q240 F256 U256 F324 EP3C40 ...

Page 4

Table 3. PCB Dimensions 2.5 mm Thick Signal Layers Notes to (1) (2) Table 4 values for Cyclone III devices on a typical board. Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part Device ...

Page 5

... F780 EP3C120 F484 F780 Cyclone II Table 5 (junction-to-case thermal resistance) values for Cyclone II devices. Devices Table 5. Thermal Resistance of Cyclone II Devices Device Package EP2C5 F256 T144 Q208 EP2C8 F256 T144 Q208 EP2C20 Q240 F256 F484 T144 EP2C35 F484 U484 F672 EP2C50 F484 ...

Page 6

... Table 6 for Cyclone II devices on a typical board. Table 6. Thermal Resistance of Cyclone II Devices Device Package EP2C5 F256 EP2C8 F256 EP2C20 F256 F484 EP2C35 F484 U484 EP2C50 F484 U484 EP2C35 F672 EP2C50 F672 F672 EP2C70 F896 Cyclone Table 7 (junction-to-case thermal resistance) values for Cyclone devices. ...

Page 7

Table 7. Thermal Resistance of Cyclone Devices (Part Device Pin Count Package EP1C20 324 FBGA 400 FBGA Copyright © 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, ...

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