MM908E624ACDWB/R2 FREESCALE [Freescale Semiconductor, Inc], MM908E624ACDWB/R2 Datasheet - Page 6

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MM908E624ACDWB/R2

Manufacturer Part Number
MM908E624ACDWB/R2
Description
Integrated Triple High-Side Switch with Embedded MCU and LIN Serial Communication for Relay Drivers
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
Table 2. Maximum Ratings (continued)
damage to the device.
6
908E624
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS
Notes
Package Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
Peak Package Reflow Temperature During Solder Mounting
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent
2.
3.
4.
MM908E624ACDWB and MM908E624ACEW
MM908E624AYEW
MM908E624ACDWB and MM908E624ACEW
MM908E624AYEW
DWB Suffix
EW (Pb-Free) Suffix
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.
Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Independent of T
package thermal resistance, and available heat sinking.
A,
device parametrics are only guaranteed for - 40 < T
Rating
(2)(4)
(4)
(3)
J
T
< 125°C . Please see note 2. T
Symbol
SOLDER
T
T
STG
T
A
J
Analog Integrated Circuit Device Data
- 40 to 125
- 40 to 125
- 40 to 125
- 40 to 150
- 40 to 85
Value
J
245
260
is a factor of power dissipation,
Freescale Semiconductor
Unit
°C
°C
°C
°C

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