AIC1384 AIC [Analog Intergrations Corporation], AIC1384 Datasheet - Page 11

• Manufacturer Part Number: AIC1384
• Description: DDR Termination Regulator
• Manufacturer: AIC [Analog Intergrations Corporation]

0.01µF
recommended.
V
V
terminate the bus resistor, which obtains the
ability of sinking and sourcing current while
regulating the output accurately to VDDQ/2. The
AIC1384 is designed to deliver up to ±3A peak
transient
response. The output capacitor should be large
enough to prevent an excessive voltage drop if a
transient is expected to last above the maximum
continuous current rating for a significant amount
of time. AIC1384 is able to provide large transient
output currents, yet it can’t handle for long
durations under all conditions that results from
the standard packages are not able to dissipate
the heat of the internal power loss. If large
currents are required for longer durations, ensure
that the maximum junction temperature is not
exceeded.
Capacitor Selection
The input capacitor of AIC1384 is required for
improved
transients to prevent the input rail from dropping.
47µF aluminum electrolytic capacitors or ceramic
capacitor is recommended. If AVIN and PVIN are
separated, the 47µF capacitor should be placed
as close as possible to the PVIN. And AVIN can
bypass a 0.1uF ceramic capacitor to prevent
excessive noise.
220µF aluminum electrolytic capacitor is a
recommendation for output capacitor to improve
load transient response of V
22uF ceramic output capacitor is allowed to
general used for obtain small profile. The value of
ESR is determined by the acceptable maximum
current spike and the output voltage droops.
TT
TT
is the regulated output that is used to
to
currents
performance
0.1µF
of
with
ceramic
during
excellent
TT
. And size above
capacitor
large
transient
load
is
The AIC1384 has a thermal-limiting circuitry,
which is designed to protect the device against
overload
condition,
temperature must not be exceeded. It is
important to pay more attention in thermal
resistance. It includes junction to case, junction
to ambient. The maximum power dissipation of
AIC1384 depends on the thermal resistance of
its case and circuit board, the temperature
difference between the die junction and ambient
air, and the rate of airflow. The thermal
resistance is greatly affected by the package
used, the number of vias, the speed of airflow
and the thickness of copper. When the IC
mounting with good thermal conductivity is used,
the junction temperature will be low even when
large power dissipation applies. So the PCB
mounting pad for GND pin of AIC1384 should
provide
maintain low device temperature.
The power dissipation across the device is
The maximum power dissipation is:
Where T
temperature (125°C), and T
temperature suitable in application.
Layout Considerations
1. Minimize high current ground loops. Place
2. Connect the bottom-side pad (available in
3. A buried layer may be used as a heat
Thermal Dissipation
the ground of the device, the input capacitor,
and the output capacitor together with short
and wide connection.
SOP-8 Exposed Pad) to a large ground
plane. Use as much copper as possible to
decrease the thermal resistance of the
device.
spreader if the large copper around the
P = I
P
MAX
J-max
OUT
maximum
=
condition.
(T
maximum
(V
is the maximum allowable junction
- J
IN
max
Rθ
-V
JA
OUT
-
T
A
thermal
).
)
For
rating
A
continuous
conductivity
is the ambient
AIC1384
of
junction
load
11
to