AIC1730 AIC [Analog Intergrations Corporation], AIC1730 Datasheet - Page 10

• Manufacturer Part Number: AIC1730
• Description: Low Noise Low Dropout, 150mA Linear Regulator
• Manufacturer: AIC [Analog Intergrations Corporation]

NOISE BYPASS CAPACITOR
Use a 0.1 F bypass capacitor at BP for low
output voltage noise. Increasing the capacitance
such as 1 F will decrease the output noise,
however,
performance
recommended.
POWER DISSIPATION
The maximum power dissipation of AIC1730
depends on the thermal resistance of the case
and circuit board, the temperature difference
between the die junction and ambient air, and
the rate of air flow. The rate of temperature rise is
greatly
configuration on the PCB, the board material,
and the ambient temperature. When the IC
mounting with good thermal conductivity is used,
the junction will be low even if the power
dissipation is great.
The power dissipation across the device is P =
I
The maximum power dissipation is:
OUT
0.01
100
0.1
(V
10
1
IN
-V
affected
OUT
values
).
advantage
50
STABLE REGION
above
by
C
I
OUT
OUT
the
(mA)
=1 F
1 F
and
mounting
100
provide
are
pad
not
no
150
0.01
100
0.1
10
1
P
where T
between the die junction and the surrounding air,
copper traces, and other materials to the
surrounding air.
As a general rule, the lower the temperature is,
the better the reliability of the device is. So the
PCB mounting pad should provide maximum
thermal conductivity to maintain low device
temperature.
The GND pin performs the dual function of
providing an electrical connection to ground and
channeling heat away. Therefore, connecting the
GND pin to ground with a large pad or ground
plane would increase the power dissipation and
reduce the device temperature.
JB
BA
MAX
is the thermal resistance of the package, and
is the thermal resistance through the PCB,
= (T
J
-T
50
J
STABLE REGION
-T
A
A
C
)/(
is the temperature difference
I
OUT
OUT
JB
=2.2 F
(mA)
+
BA
100
)
AIC1730
150
10