Chip Beads(SMD Array)
For Audio / USB1.1 Signal Line
MCZ Series MCZ1210-D Type(2-Line)
This is a common type bead product that removes the noise com-
ponents in a signal line and includes beads for two lines in a single
chip. The product exhibits substantial impedance characteristics in
the high frequency range and is therefore capable of effectively
removing differential mode noises. Additionally, an appropriate
amount of magnetic coupling is created between the beads of the
two lines, giving the product the capability to remove not only dif-
ferential mode noise but common mode noise as well. It is
encased in a 1210 casing. This is an SMD product that allows for
automatic mounting by taping.
FEATURES
• Compact size, Low Rdc (0.75Ω max.)
• Capable of removing both common and differential mode noises.
• Closed magnetic circuit structure allows high-density installation
APPLICATIONS
Audio signal lines used in cell phones and mobile audio devices,
personal computers and peripheral equipment, PDA, digital cam-
era, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L× W
(3) Ferrite material
(4) Number of line
(5) Impedance
(6) Packaging style
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MCZ 1210 A
(1)
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
while preventing crosstalk between circuits.
102:1000Ω at 100MHz
T:Taping
(2)
(3) (4) (5) (6)
D 102 T
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
CIRCUIT DIAGRAM
TEMPERATURE RANGES
Operating/Storage
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
• No polarity
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
4
1
4
1
1.25±0.15
0.65±0.15
3
2
3
2
T
0.5±0.10
0.85±0.15
–40 to +85°C
Quantity
4000 pieces/reel
003-03 / 20061022 / e9421_mcz1210.fm
Conformity to RoHS Directive
0.35 to 0.40
Dimensions in mm
0.3
(1/3)