ADUC814_02 AD [Analog Devices], ADUC814_02 Datasheet - Page 13

• Manufacturer Part Number: ADUC814_02
• Description: MicroConverter, Small Package 12-Bit ADC with Embedded FLASH MCU
• Manufacturer: AD [Analog Devices]

ABSOLUTE MAXIMUM RATINGS
(T
AV
DV
AV
AGND to DGND
Analog Input Voltage to AGND
Reference Input Voltage to AGND . . –0.3 V to AV
Analog Input Current (Indefinite) . . . . . . . . . . . . . . . . . 30 mA
Reference Input Current (Indefinite) . . . . . . . . . . . . . . . 30 mA
Digital Input Voltage to DGND . . . . –0.3 V to DV
Digital Output Voltage to DGND . . . –0.3 V to DV
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
θ
Lead Temperature, Soldering
NOTES
1
2
3
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADuC814 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. 0
Model
ADuC814ARU
ADuC814BRU
QuickStart Development System Model
EVAL-ADuC814QS
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
AGND and DGND are shorted internally on the ADuC814.
Applies to P1.2 to P1.7 pins operating in analog or digital input modes.
JA
A
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
DD
DD
= 25°C, unless otherwise noted.)
DD
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 97.9°C/W
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DV
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DD
. . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
2
. . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
3
Temperature
Range
–40°C to +125°C
–40°C to +125°C
. . . . –0.3 V to AV
1
DD
DD
DD
DD
Description
Development System for the ADuC814 MicroConverter Contains:
• Evaluation Board
• Serial Port Cable
• Windows Serial Downloader (WSD)
• Windows Debugger (DeBug)
• Windows ADuC814 Simulator (ADSIM)
• Windows ADC Analysis Software Program (WASP)
• 8051 Assembler (Metalink)
• Example Code
• Documentation
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
–13–
Package
Description
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
P3.4/T0/CONVST
P1.2/ADC0
P1.3/ADC1
P1.1/T2EX
P3.2/INT0
P3.3/INT1
P3.0/RXD
P3.1/TXD
DLOAD
P1.0/T2
RESET
DGND
AGND
AV
DD
PIN CONFIGURATION
10
11
12
13
14
1
2
3
4
5
6
7
8
9
28-Lead TSSOP
(Not to Scale)
ADuC814
TOP VIEW
WARNING!
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DV
XTAL2
XTAL1
SCLOCK
P3.7/MOSI
P3.6/MISO
P3.5/T1/SS/EXTCLK
P1.7/ADC5/DAC1
P1.6/ADC4/DAC0
P1.5/ADC3
P1.4/ADC2
CREF
VREF
AGND
ESD SENSITIVE DEVICE
DD
Package
Option
RU-28
RU-28
ADuC814