ISD17150XYI WINBOND [Winbond], ISD17150XYI Datasheet - Page 5

• Manufacturer Part Number: ISD17150XYI
• Description: Multi-Message Single-Chip Voice Record & Playback Devices
• Manufacturer: WINBOND [Winbond]

3 BLOCK DIAGRAM
AnaIn
Temperature options:
Packaging types: available in die, PDIP, SOIC and TSOP
Package option: Lead-free packaged units
MIC-
R
MIC+
AGC
OSC
o
o
Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)
Industrial: -40°C to +85°C (packaged units)
V
AnaIn
CCA
Amp
AGC
Amp
V
Power Conditioning
SSA
Internal
Clock
V
CCP
V
Gain Control
SSP1
Automatic
V
SSP2
Aliasing
Filter
Anti-
V
SSD
Timing
V
CCD
REC PLAY ERASE
Multi-Level Storage
Nonvolatile
Array
Sampling
Clock
- 5 -
Device Control
FWD
FT
RESET
Smoothing
Filter
VOL
Publication Release Date: January 23, 2007
INT/RDY
LED
ISD1700 SERIES
Volume
Control
SS
SPI Interface
SCLK
MOSI
Amp
Amp
MISO
Revision 1.3-S2
AUD /
AUX
SP+
SP-