LM2940S NSC [National Semiconductor], LM2940S Datasheet - Page 15

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LM2940S

Manufacturer Part Number
LM2940S
Description
1A Low Dropout Regulator
Manufacturer
NSC [National Semiconductor]
Datasheet

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HEATSINKING LLP PACKAGE PARTS
The value of θ
for the LLP package is specifically dependent
JA
on PCB trace area, trace material, and the number of layers
and thermal vias. It is recommended that a minimum of 6
thermal vias be placed under the center pad to improve ther-
mal performance.
For techniques for improving the thermal resistance and pow-
er dissipation for the LLP package, please refer to Application
Note AN-1187.
882241
FIGURE 6. Maximum Power Dissipation vs. T
for the
A
SOT-223 Package
15
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